Four-Level Micro-Via Technology (4LµV) for ASIC Integration in Active Flexible Sensor Arrays

por Zhou, Maolei, von der Heide, Chresten, Dietzel, Andreas
Publicado 2022

Smart Inlays for Simultaneous Crack Sensing and Arrest in Multifunctional Bondlines of Composites

por von der Heide, Chresten, Steinmetz, Julian, Schollerer, Martin J., Hühne, Christian, Sinapius, Michael, Dietzel, Andreas
Publicado 2021

Space-Filling Curve Resistor on Ultra-Thin Polyetherimide Foil for Strain Impervious Temperature Sensing

por Rager, Korbinian, Jaworski, David, von der Heide, Chresten, Kyriazis, Alexander, Sinapius, Michael, Constantinou, Iordania, Dietzel, Andreas
Publicado 2021

Polyetherimide-Reinforced Smart Inlays for Bondline Surveillance in Composites

por von der Heide, Chresten, Steinmetz, Julian, Völkerink, Oliver, Makiela, Patrick, Hühne, Christian, Sinapius, Michael, Dietzel, Andreas
Publicado 2022