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| LEADER |
00000cam a22000002a 4500 |
| 001 |
ocm53030765 |
| 003 |
OCoLC |
| 005 |
20220706124024.0 |
| 008 |
060512s2004 enka b eng d |
| 035 |
|
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|a (Sirsi) i9780863413353
|
| 040 |
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|a UKM
|c UKM
|d TPN
|d UV#
|
| 020 |
|
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|a 0863413358
|
| 082 |
|
4 |
|a 621.381
|2 22
|
| 050 |
|
4 |
|a TK7874
|b M45
|
| 245 |
0 |
0 |
|a MEMS packaging
|c / [ed. por] Tai-Ran Hsu.
|
| 260 |
|
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|a London :
|b INSPEC,
|c c2004.
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| 300 |
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|a xxix, 275 p. :
|b il. ;
|c 26 cm.
|
| 490 |
0 |
0 |
|a EMIS processing series ;
|v no. 3
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| 500 |
|
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|a Glosario: p. 249-259.
|
| 504 |
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|a Incluye bibliografías.
|
| 650 |
|
4 |
|a Circuitos integrados.
|
| 650 |
|
7 |
|a Microelectrónica
|9 3804
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| 700 |
1 |
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|a Hsu, Tai-Ran.
|9 368026
|
| 902 |
|
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|a DGBUV
|
| 596 |
|
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|a 15 39
|
| 942 |
|
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|c LIBRO
|
| 999 |
|
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|c 194165
|d 194165
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