On the formation of voids in internal tin Nb$_{3}$Sn superconductors

In this article we describe three void growth mechanisms in Nb$_{3}$Sn strands of the internal tin design on the basis of combined synchrotron micro-tomography and x-ray diffraction measurements during in-situ heating cycles. Initially void growth is driven by a reduction of void surface area by void agglomeration. The main void volume increase is caused by density changes during the formation of Cu3Sn in the strand. Subsequent transformation of Cu-Sn intermetallics into the lower density a-bronze reduces the void volume again. Long lasting temperature ramps and isothermal holding steps can neither reduce the void volume nor improve the chemical strand homogeneity prior to the superconducting A15 phase nucleation and growth.