Wafer test of the LHCb Outer Tracker TDC-Chip

The OTIS-TDC is the front end readout chip for the LHCb Outer Tracker. It is designed to measure drift times with a resolution better than 1 ns. As the chip will be directly mounted to its board, the test have to be performed on the wafer itself. As the testing period for 7 000 chips was only three...

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Detalles Bibliográficos
Autores principales: Knopf, Jan, Muckerheide, R, Stange, U, Trunk, U, Uwer, U, Wiedner, D
Lenguaje:eng
Publicado: CERN 2007
Materias:
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.5170/CERN-2007-001.475
http://cds.cern.ch/record/1034301
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author Knopf, Jan
Muckerheide, R
Stange, U
Trunk, U
Uwer, U
Wiedner, D
author_facet Knopf, Jan
Muckerheide, R
Stange, U
Trunk, U
Uwer, U
Wiedner, D
author_sort Knopf, Jan
collection CERN
description The OTIS-TDC is the front end readout chip for the LHCb Outer Tracker. It is designed to measure drift times with a resolution better than 1 ns. As the chip will be directly mounted to its board, the test have to be performed on the wafer itself. As the testing period for 7 000 chips was only three weeks, many test routines have been implemented on a FPGA. Each chip is subjected to detailed probe testing to ensure the full functionality as well as a good performance. Overall 47 wafer have been tested. From the chips passing the test 2 000 have been used in the Outer Tracker front end electronic.
id cern-1034301
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2007
publisher CERN
record_format invenio
spelling cern-10343012019-09-30T06:29:59Zdoi:10.5170/CERN-2007-001.475http://cds.cern.ch/record/1034301engKnopf, JanMuckerheide, RStange, UTrunk, UUwer, UWiedner, DWafer test of the LHCb Outer Tracker TDC-ChipDetectors and Experimental TechniquesThe OTIS-TDC is the front end readout chip for the LHCb Outer Tracker. It is designed to measure drift times with a resolution better than 1 ns. As the chip will be directly mounted to its board, the test have to be performed on the wafer itself. As the testing period for 7 000 chips was only three weeks, many test routines have been implemented on a FPGA. Each chip is subjected to detailed probe testing to ensure the full functionality as well as a good performance. Overall 47 wafer have been tested. From the chips passing the test 2 000 have been used in the Outer Tracker front end electronic.CERNoai:cds.cern.ch:10343012007
spellingShingle Detectors and Experimental Techniques
Knopf, Jan
Muckerheide, R
Stange, U
Trunk, U
Uwer, U
Wiedner, D
Wafer test of the LHCb Outer Tracker TDC-Chip
title Wafer test of the LHCb Outer Tracker TDC-Chip
title_full Wafer test of the LHCb Outer Tracker TDC-Chip
title_fullStr Wafer test of the LHCb Outer Tracker TDC-Chip
title_full_unstemmed Wafer test of the LHCb Outer Tracker TDC-Chip
title_short Wafer test of the LHCb Outer Tracker TDC-Chip
title_sort wafer test of the lhcb outer tracker tdc-chip
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.5170/CERN-2007-001.475
http://cds.cern.ch/record/1034301
work_keys_str_mv AT knopfjan wafertestofthelhcboutertrackertdcchip
AT muckerheider wafertestofthelhcboutertrackertdcchip
AT stangeu wafertestofthelhcboutertrackertdcchip
AT trunku wafertestofthelhcboutertrackertdcchip
AT uweru wafertestofthelhcboutertrackertdcchip
AT wiednerd wafertestofthelhcboutertrackertdcchip

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