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A fine pitch bump bonding process compatible with the manufacture of the pixel-HPD's for the LHCb RICH detector

Detalles Bibliográficos
Autor principal:	Campbell, M
Lenguaje:	eng
Publicado:	2006
Materias:	Detectors and Experimental Techniques Engineering
Acceso en línea:	https://dx.doi.org/10.1109/TNS.2006.880537 http://cds.cern.ch/record/1035606

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