The CMS Pixel Detector: from production to commissioning

The CMS experiment at the LHC includes a hybrid silicon pixel detector for the reconstruction of charged tracks and of the interaction vertices. The detector is made of three barrel layers and two disks at each end of the barrel. Detector modules consist of thin, segmented silicon sensors with highl...

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Detalles Bibliográficos
Autor principal: Chiochia, Vincenzo
Lenguaje:eng
Publicado: 2007
Materias:
physics.ins-det
Acceso en línea:http://cds.cern.ch/record/1065323
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author Chiochia, Vincenzo
author_facet Chiochia, Vincenzo
author_sort Chiochia, Vincenzo
collection CERN
description The CMS experiment at the LHC includes a hybrid silicon pixel detector for the reconstruction of charged tracks and of the interaction vertices. The detector is made of three barrel layers and two disks at each end of the barrel. Detector modules consist of thin, segmented silicon sensors with highly integrated readout chips connected by the bump bonding technique. In this paper we report on the progress of the detector construction and testing. In addition, first results from the commissioning systems at CERN and PSI are presented.
id cern-1065323
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2007
record_format invenio
spelling cern-10653232023-03-14T16:46:49Zhttp://cds.cern.ch/record/1065323engChiochia, VincenzoThe CMS Pixel Detector: from production to commissioningphysics.ins-detThe CMS experiment at the LHC includes a hybrid silicon pixel detector for the reconstruction of charged tracks and of the interaction vertices. The detector is made of three barrel layers and two disks at each end of the barrel. Detector modules consist of thin, segmented silicon sensors with highly integrated readout chips connected by the bump bonding technique. In this paper we report on the progress of the detector construction and testing. In addition, first results from the commissioning systems at CERN and PSI are presented.The CMS experiment at the LHC includes a hybrid silicon pixel detector for the reconstruction of charged tracks and of the interaction vertices. The detector is made of three barrel layers and two disks at each end of the barrel. Detector modules consist of thin, segmented silicon sensors with highly integrated readout chips connected by the bump bonding technique. In this paper we report on the progress of the detector construction and testing. In addition, first results from the commissioning systems at CERN and PSI are presented.arXiv:0710.5120oai:cds.cern.ch:10653232007-10-29
spellingShingle physics.ins-det
Chiochia, Vincenzo
The CMS Pixel Detector: from production to commissioning
title The CMS Pixel Detector: from production to commissioning
title_full The CMS Pixel Detector: from production to commissioning
title_fullStr The CMS Pixel Detector: from production to commissioning
title_full_unstemmed The CMS Pixel Detector: from production to commissioning
title_short The CMS Pixel Detector: from production to commissioning
title_sort cms pixel detector: from production to commissioning
topic physics.ins-det
url http://cds.cern.ch/record/1065323
work_keys_str_mv AT chiochiavincenzo thecmspixeldetectorfromproductiontocommissioning
AT chiochiavincenzo cmspixeldetectorfromproductiontocommissioning

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