VELO Module Production - Front End Bonding

This note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) down to the Pitch Adaptors for the LHCb VELO detector modules.

Detalles Bibliográficos
Autores principales: Whitley, M, Wormald, M
Lenguaje:eng
Publicado: 2007
Materias:
Detectors and Experimental Techniques
Acceso en línea:http://cds.cern.ch/record/1067144
Descripción
Sumario:This note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) down to the Pitch Adaptors for the LHCb VELO detector modules.

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