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VELO Module Production - Front End Bonding
This note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) down to the Pitch Adaptors for the LHCb VELO detector modules.
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
2007
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1067144 |
| _version_ | 1780913293040287744 |
|---|---|
| author | Whitley, M Wormald, M |
| author_facet | Whitley, M Wormald, M |
| author_sort | Whitley, M |
| collection | CERN |
| description | This note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) down to the Pitch Adaptors for the LHCb VELO detector modules. |
| id | cern-1067144 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2007 |
| record_format | invenio |
| spelling | cern-10671442019-09-30T06:29:59Zhttp://cds.cern.ch/record/1067144engWhitley, MWormald, MVELO Module Production - Front End BondingDetectors and Experimental TechniquesThis note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) down to the Pitch Adaptors for the LHCb VELO detector modules.LHCb-2007-079CERN-LHCb-2007-079oai:cds.cern.ch:10671442007-11-06 |
| spellingShingle | Detectors and Experimental Techniques Whitley, M Wormald, M VELO Module Production - Front End Bonding |
| title | VELO Module Production - Front End Bonding |
| title_full | VELO Module Production - Front End Bonding |
| title_fullStr | VELO Module Production - Front End Bonding |
| title_full_unstemmed | VELO Module Production - Front End Bonding |
| title_short | VELO Module Production - Front End Bonding |
| title_sort | velo module production - front end bonding |
| topic | Detectors and Experimental Techniques |
| url | http://cds.cern.ch/record/1067144 |
| work_keys_str_mv | AT whitleym velomoduleproductionfrontendbonding AT wormaldm velomoduleproductionfrontendbonding |