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VELO Module Production - Front End Bonding
This note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) down to the Pitch Adaptors for the LHCb VELO detector modules.
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
2007
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1067144 |