3D System Integration for high density Interconnects

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexi...

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Detalles Bibliográficos
Autores principales: Wieland, R M, Klumpp, A, Ramm, P
Lenguaje:eng
Publicado: CERN 2007
Materias:
Accelerators and Storage Rings
Acceso en línea:https://dx.doi.org/10.5170/CERN-2007-007.64
http://cds.cern.ch/record/1089028
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author Wieland, R M
Klumpp, A
Ramm, P
author_facet Wieland, R M
Klumpp, A
Ramm, P
author_sort Wieland, R M
collection CERN
description 3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity by combining devices of different technologies. The fundamental processing steps will be described, as well as appropriate handling concepts and first electrical results of realized 3D-integrated stacks.
id cern-1089028
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2007
publisher CERN
record_format invenio
spelling cern-10890282019-09-30T06:29:59Zdoi:10.5170/CERN-2007-007.64http://cds.cern.ch/record/1089028engWieland, R MKlumpp, ARamm, P3D System Integration for high density InterconnectsAccelerators and Storage Rings3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity by combining devices of different technologies. The fundamental processing steps will be described, as well as appropriate handling concepts and first electrical results of realized 3D-integrated stacks.CERNoai:cds.cern.ch:10890282007
spellingShingle Accelerators and Storage Rings
Wieland, R M
Klumpp, A
Ramm, P
3D System Integration for high density Interconnects
title 3D System Integration for high density Interconnects
title_full 3D System Integration for high density Interconnects
title_fullStr 3D System Integration for high density Interconnects
title_full_unstemmed 3D System Integration for high density Interconnects
title_short 3D System Integration for high density Interconnects
title_sort 3d system integration for high density interconnects
topic Accelerators and Storage Rings
url https://dx.doi.org/10.5170/CERN-2007-007.64
http://cds.cern.ch/record/1089028
work_keys_str_mv AT wielandrm 3dsystemintegrationforhighdensityinterconnects
AT klumppa 3dsystemintegrationforhighdensityinterconnects
AT rammp 3dsystemintegrationforhighdensityinterconnects

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