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3D System Integration for high density Interconnects
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexi...
| Autores principales: | , , |
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| Lenguaje: | eng |
| Publicado: |
CERN
2007
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.5170/CERN-2007-007.64 http://cds.cern.ch/record/1089028 |