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LHCb: Pixel Rich

A Fine Pitch Bump Bonding Process compatible with the Manufacture of the Pixel-HPD's for the LHCb rICH Detector

Detalles Bibliográficos
Autor principal: LHCb, Collaboration
Lenguaje:eng
Publicado: 2005
Acceso en línea:http://cds.cern.ch/record/1121755
_version_ 1780914581689860096
author LHCb, Collaboration
author_facet LHCb, Collaboration
author_sort LHCb, Collaboration
collection CERN
description A Fine Pitch Bump Bonding Process compatible with the Manufacture of the Pixel-HPD's for the LHCb rICH Detector
id cern-1121755
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2005
record_format invenio
spelling cern-11217552019-09-30T06:29:59Zhttp://cds.cern.ch/record/1121755engLHCb, CollaborationLHCb: Pixel RichA Fine Pitch Bump Bonding Process compatible with the Manufacture of the Pixel-HPD's for the LHCb rICH DetectorPoster-2008-031oai:cds.cern.ch:11217552005-08-25
spellingShingle LHCb, Collaboration
LHCb: Pixel Rich
title LHCb: Pixel Rich
title_full LHCb: Pixel Rich
title_fullStr LHCb: Pixel Rich
title_full_unstemmed LHCb: Pixel Rich
title_short LHCb: Pixel Rich
title_sort lhcb: pixel rich
url http://cds.cern.ch/record/1121755
work_keys_str_mv AT lhcbcollaboration lhcbpixelrich