Bonding of the Inner Tracker Silicon Microstrip Modules

Microbonding of the CMS Tracker Inner Barrel (TIB) and Tracker Inner Disks (TID) modules was shared among six different Italian Institutes. The organization devised and the infrastructure deployed to handle this task is illustrated. Microbonding specifications and procedures for the different types of TIB and TID modules are given. The tooling specially designed and developed for these types of modules is described. Experience of production is presented. Attained production rates are given. An analysis of the microbonding quality achieved is presented, based on bond strengths measured in sample bond pull tests as well as on rates of bonding failures. Italian Bonding Centers routinely performed well above minimum specifications and a very low global introduced failure rate, at the strip level, of only $\sim$0.015 \% is observed.