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Bonding of the Inner Tracker Silicon Microstrip Modules
Microbonding of the CMS Tracker Inner Barrel (TIB) and Tracker Inner Disks (TID) modules was shared among six different Italian Institutes. The organization devised and the infrastructure deployed to handle this task is illustrated. Microbonding specifications and procedures for the different types...
| Autores principales: | , , , , , , , , , , , , , , , , , , , , |
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| Lenguaje: | eng |
| Publicado: |
2008
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1127568 |
| _version_ | 1780914876760195072 |
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| author | Bosi, Filippo Brasolin, S Brianzi, Mirko Cariola, P Costa, Salvatore Demaria, Natale Dumitrache, Floarea Farano, R Fiore, Luigi Galet, G Giudice, Nunzio Kaminski, A Mammini, Paolo Manolescu, Florentina Pantano, Devis Profeti, Alessandro Raimondo, F S Saizu, Mirela Angela Scarlini, Enrico Tempesta, Paolo Tessaro, Mario |
| author_facet | Bosi, Filippo Brasolin, S Brianzi, Mirko Cariola, P Costa, Salvatore Demaria, Natale Dumitrache, Floarea Farano, R Fiore, Luigi Galet, G Giudice, Nunzio Kaminski, A Mammini, Paolo Manolescu, Florentina Pantano, Devis Profeti, Alessandro Raimondo, F S Saizu, Mirela Angela Scarlini, Enrico Tempesta, Paolo Tessaro, Mario |
| author_sort | Bosi, Filippo |
| collection | CERN |
| description | Microbonding of the CMS Tracker Inner Barrel (TIB) and Tracker Inner Disks (TID) modules was shared among six different Italian Institutes. The organization devised and the infrastructure deployed to handle this task is illustrated. Microbonding specifications and procedures for the different types of TIB and TID modules are given. The tooling specially designed and developed for these types of modules is described. Experience of production is presented. Attained production rates are given. An analysis of the microbonding quality achieved is presented, based on bond strengths measured in sample bond pull tests as well as on rates of bonding failures. Italian Bonding Centers routinely performed well above minimum specifications and a very low global introduced failure rate, at the strip level, of only $\sim$0.015 \% is observed. |
| id | cern-1127568 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2008 |
| record_format | invenio |
| spelling | cern-11275682019-09-30T06:29:59Zhttp://cds.cern.ch/record/1127568engBosi, FilippoBrasolin, SBrianzi, MirkoCariola, PCosta, SalvatoreDemaria, NataleDumitrache, FloareaFarano, RFiore, LuigiGalet, GGiudice, NunzioKaminski, AMammini, PaoloManolescu, FlorentinaPantano, DevisProfeti, AlessandroRaimondo, F SSaizu, Mirela AngelaScarlini, EnricoTempesta, PaoloTessaro, MarioBonding of the Inner Tracker Silicon Microstrip ModulesDetectors and Experimental TechniquesMicrobonding of the CMS Tracker Inner Barrel (TIB) and Tracker Inner Disks (TID) modules was shared among six different Italian Institutes. The organization devised and the infrastructure deployed to handle this task is illustrated. Microbonding specifications and procedures for the different types of TIB and TID modules are given. The tooling specially designed and developed for these types of modules is described. Experience of production is presented. Attained production rates are given. An analysis of the microbonding quality achieved is presented, based on bond strengths measured in sample bond pull tests as well as on rates of bonding failures. Italian Bonding Centers routinely performed well above minimum specifications and a very low global introduced failure rate, at the strip level, of only $\sim$0.015 \% is observed.CMS-NOTE-2008-024oai:cds.cern.ch:11275682008-05-11 |
| spellingShingle | Detectors and Experimental Techniques Bosi, Filippo Brasolin, S Brianzi, Mirko Cariola, P Costa, Salvatore Demaria, Natale Dumitrache, Floarea Farano, R Fiore, Luigi Galet, G Giudice, Nunzio Kaminski, A Mammini, Paolo Manolescu, Florentina Pantano, Devis Profeti, Alessandro Raimondo, F S Saizu, Mirela Angela Scarlini, Enrico Tempesta, Paolo Tessaro, Mario Bonding of the Inner Tracker Silicon Microstrip Modules |
| title | Bonding of the Inner Tracker Silicon Microstrip Modules |
| title_full | Bonding of the Inner Tracker Silicon Microstrip Modules |
| title_fullStr | Bonding of the Inner Tracker Silicon Microstrip Modules |
| title_full_unstemmed | Bonding of the Inner Tracker Silicon Microstrip Modules |
| title_short | Bonding of the Inner Tracker Silicon Microstrip Modules |
| title_sort | bonding of the inner tracker silicon microstrip modules |
| topic | Detectors and Experimental Techniques |
| url | http://cds.cern.ch/record/1127568 |
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