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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis

Detalles Bibliográficos
Autor principal: Jamnia, Ali
Lenguaje:eng
Publicado: Dekker 2002
Materias:
Acceso en línea:http://cds.cern.ch/record/1141553
_version_ 1780915590838353920
author Jamnia, Ali
author_facet Jamnia, Ali
author_sort Jamnia, Ali
collection CERN
id cern-1141553
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2002
publisher Dekker
record_format invenio
spelling cern-11415532021-04-22T01:41:22Zhttp://cds.cern.ch/record/1141553engJamnia, AliPractical Guide to the Packaging of Electronics: Thermal and Mechanical Design and AnalysisEngineeringDekkeroai:cds.cern.ch:11415532002
spellingShingle Engineering
Jamnia, Ali
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis
title Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis
title_full Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis
title_fullStr Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis
title_full_unstemmed Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis
title_short Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis
title_sort practical guide to the packaging of electronics: thermal and mechanical design and analysis
topic Engineering
url http://cds.cern.ch/record/1141553
work_keys_str_mv AT jamniaali practicalguidetothepackagingofelectronicsthermalandmechanicaldesignandanalysis