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3D IC Pixel Electronics- the Next Challenge

There is no question that 3D integrated circuit design will play an important role in the continuing development of high performance integrated circuits. This paper will provide a brief introduction to the markets for 3D integrated circuits and the technologies that are used, followed by a review of...

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Detalles Bibliográficos
Autor principal: Yarema, R
Lenguaje:eng
Publicado: CERN 2008
Materias:
Acceso en línea:https://dx.doi.org/10.5170/CERN-2008-008.183
http://cds.cern.ch/record/1158550
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author Yarema, R
author_facet Yarema, R
author_sort Yarema, R
collection CERN
description There is no question that 3D integrated circuit design will play an important role in the continuing development of high performance integrated circuits. This paper will provide a brief introduction to the markets for 3D integrated circuits and the technologies that are used, followed by a review of 3D activities in High Energy Physics (HEP). The paper will review the first 3D chip for HEP and conclude with discussion of a collaborative effort to use a commercial vendor to fabricate 3D ICs as a path forward to meet the next challenge for electronics designers in HEP .
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institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2008
publisher CERN
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spelling cern-11585502019-09-30T06:29:59Zdoi:10.5170/CERN-2008-008.183http://cds.cern.ch/record/1158550engYarema, R3D IC Pixel Electronics- the Next ChallengeDetectors and Experimental TechniquesThere is no question that 3D integrated circuit design will play an important role in the continuing development of high performance integrated circuits. This paper will provide a brief introduction to the markets for 3D integrated circuits and the technologies that are used, followed by a review of 3D activities in High Energy Physics (HEP). The paper will review the first 3D chip for HEP and conclude with discussion of a collaborative effort to use a commercial vendor to fabricate 3D ICs as a path forward to meet the next challenge for electronics designers in HEP .CERNoai:cds.cern.ch:11585502008
spellingShingle Detectors and Experimental Techniques
Yarema, R
3D IC Pixel Electronics- the Next Challenge
title 3D IC Pixel Electronics- the Next Challenge
title_full 3D IC Pixel Electronics- the Next Challenge
title_fullStr 3D IC Pixel Electronics- the Next Challenge
title_full_unstemmed 3D IC Pixel Electronics- the Next Challenge
title_short 3D IC Pixel Electronics- the Next Challenge
title_sort 3d ic pixel electronics- the next challenge
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.5170/CERN-2008-008.183
http://cds.cern.ch/record/1158550
work_keys_str_mv AT yaremar 3dicpixelelectronicsthenextchallenge