Cargando…
3D IC Pixel Electronics- the Next Challenge
There is no question that 3D integrated circuit design will play an important role in the continuing development of high performance integrated circuits. This paper will provide a brief introduction to the markets for 3D integrated circuits and the technologies that are used, followed by a review of...
Autor principal: | |
---|---|
Lenguaje: | eng |
Publicado: |
CERN
2008
|
Materias: | |
Acceso en línea: | https://dx.doi.org/10.5170/CERN-2008-008.183 http://cds.cern.ch/record/1158550 |
_version_ | 1780915809468547072 |
---|---|
author | Yarema, R |
author_facet | Yarema, R |
author_sort | Yarema, R |
collection | CERN |
description | There is no question that 3D integrated circuit design will play an important role in the continuing development of high performance integrated circuits. This paper will provide a brief introduction to the markets for 3D integrated circuits and the technologies that are used, followed by a review of 3D activities in High Energy Physics (HEP). The paper will review the first 3D chip for HEP and conclude with discussion of a collaborative effort to use a commercial vendor to fabricate 3D ICs as a path forward to meet the next challenge for electronics designers in HEP . |
id | cern-1158550 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2008 |
publisher | CERN |
record_format | invenio |
spelling | cern-11585502019-09-30T06:29:59Zdoi:10.5170/CERN-2008-008.183http://cds.cern.ch/record/1158550engYarema, R3D IC Pixel Electronics- the Next ChallengeDetectors and Experimental TechniquesThere is no question that 3D integrated circuit design will play an important role in the continuing development of high performance integrated circuits. This paper will provide a brief introduction to the markets for 3D integrated circuits and the technologies that are used, followed by a review of 3D activities in High Energy Physics (HEP). The paper will review the first 3D chip for HEP and conclude with discussion of a collaborative effort to use a commercial vendor to fabricate 3D ICs as a path forward to meet the next challenge for electronics designers in HEP .CERNoai:cds.cern.ch:11585502008 |
spellingShingle | Detectors and Experimental Techniques Yarema, R 3D IC Pixel Electronics- the Next Challenge |
title | 3D IC Pixel Electronics- the Next Challenge |
title_full | 3D IC Pixel Electronics- the Next Challenge |
title_fullStr | 3D IC Pixel Electronics- the Next Challenge |
title_full_unstemmed | 3D IC Pixel Electronics- the Next Challenge |
title_short | 3D IC Pixel Electronics- the Next Challenge |
title_sort | 3d ic pixel electronics- the next challenge |
topic | Detectors and Experimental Techniques |
url | https://dx.doi.org/10.5170/CERN-2008-008.183 http://cds.cern.ch/record/1158550 |
work_keys_str_mv | AT yaremar 3dicpixelelectronicsthenextchallenge |