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The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors

Modern front-end amplifiers for silicon strip detectors offer fast shaping but consequently are susceptible to input capacitance which is the main contribution to the noise figure. Hence, the amplifier must be close to the sensor which is not an issue at LHC, but a major concern at material budget s...

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Detalles Bibliográficos
Autores principales: Friedl, M, Irmler, C, Pernicka, M
Lenguaje:eng
Publicado: CERN 2008
Materias:
Acceso en línea:https://dx.doi.org/10.5170/CERN-2008-008.277
http://cds.cern.ch/record/1158641
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author Friedl, M
Irmler, C
Pernicka, M
author_facet Friedl, M
Irmler, C
Pernicka, M
author_sort Friedl, M
collection CERN
description Modern front-end amplifiers for silicon strip detectors offer fast shaping but consequently are susceptible to input capacitance which is the main contribution to the noise figure. Hence, the amplifier must be close to the sensor which is not an issue at LHC, but a major concern at material budget sensitive experiments such as Belle or the ILC detector. We present a design of a silicon detector module with double-sided readout where thinned front-end chips are aligned on one side of the sensor which allows efficient cooling using just a single, thin aluminum pipe. The connection to the other sensor side is established by thin kapton circuits wrapped around the edge – hence the nickname origami.
id cern-1158641
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2008
publisher CERN
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spelling cern-11586412019-09-30T06:29:59Zdoi:10.5170/CERN-2008-008.277http://cds.cern.ch/record/1158641engFriedl, MIrmler, CPernicka, MThe Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon DetectorsDetectors and Experimental TechniquesModern front-end amplifiers for silicon strip detectors offer fast shaping but consequently are susceptible to input capacitance which is the main contribution to the noise figure. Hence, the amplifier must be close to the sensor which is not an issue at LHC, but a major concern at material budget sensitive experiments such as Belle or the ILC detector. We present a design of a silicon detector module with double-sided readout where thinned front-end chips are aligned on one side of the sensor which allows efficient cooling using just a single, thin aluminum pipe. The connection to the other sensor side is established by thin kapton circuits wrapped around the edge – hence the nickname origami.CERNoai:cds.cern.ch:11586412008
spellingShingle Detectors and Experimental Techniques
Friedl, M
Irmler, C
Pernicka, M
The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors
title The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors
title_full The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors
title_fullStr The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors
title_full_unstemmed The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors
title_short The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors
title_sort origami chip-on-sensor concept for low-mass readout of double-sided silicon detectors
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.5170/CERN-2008-008.277
http://cds.cern.ch/record/1158641
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