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Digital Architecture of the New ATLAS Pixel Chip FE-I4
With the high hit rate foreseen for the innermost layers at an upgraded LHC, the current ATLAS Front-End pixel chip FE-I3 would start being inefficient. The main source of inefficiency comes from the copying mechanism of the pixel hits from the pixel array to the end of column buffers. A new ATLAS p...
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Lenguaje: | eng |
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2009
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Acceso en línea: | http://cds.cern.ch/record/1212960 |
_version_ | 1780918048393265152 |
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author | "Barbero, M |
author_facet | "Barbero, M |
author_sort | "Barbero, M |
collection | CERN |
description | With the high hit rate foreseen for the innermost layers at an upgraded LHC, the current ATLAS Front-End pixel chip FE-I3 would start being inefficient. The main source of inefficiency comes from the copying mechanism of the pixel hits from the pixel array to the end of column buffers. A new ATLAS pixel chip FE-I4 is being developed in a 130 nm technology for use both in the framework of the Insertable B-Layer (IBL) project and for the outer layers of Super-LHC. FE-I4 is 80×336 pixels wide and features a reduced pixel size of 50×250 μm2. In the current design, a new digital architecture is introduced in which hit memories are distributed across the entire chip and the pixels organized in regions. Additional features include neighbor hit checking which allows a timewalk-less hit recording. |
id | cern-1212960 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2009 |
record_format | invenio |
spelling | cern-12129602019-09-30T06:29:59Zhttp://cds.cern.ch/record/1212960eng"Barbero, MDigital Architecture of the New ATLAS Pixel Chip FE-I4Detectors and Experimental TechniquesWith the high hit rate foreseen for the innermost layers at an upgraded LHC, the current ATLAS Front-End pixel chip FE-I3 would start being inefficient. The main source of inefficiency comes from the copying mechanism of the pixel hits from the pixel array to the end of column buffers. A new ATLAS pixel chip FE-I4 is being developed in a 130 nm technology for use both in the framework of the Insertable B-Layer (IBL) project and for the outer layers of Super-LHC. FE-I4 is 80×336 pixels wide and features a reduced pixel size of 50×250 μm2. In the current design, a new digital architecture is introduced in which hit memories are distributed across the entire chip and the pixels organized in regions. Additional features include neighbor hit checking which allows a timewalk-less hit recording.ATL-UPGRADE-SLIDE-2009-320oai:cds.cern.ch:12129602009-10-16 |
spellingShingle | Detectors and Experimental Techniques "Barbero, M Digital Architecture of the New ATLAS Pixel Chip FE-I4 |
title | Digital Architecture of the New ATLAS Pixel Chip FE-I4 |
title_full | Digital Architecture of the New ATLAS Pixel Chip FE-I4 |
title_fullStr | Digital Architecture of the New ATLAS Pixel Chip FE-I4 |
title_full_unstemmed | Digital Architecture of the New ATLAS Pixel Chip FE-I4 |
title_short | Digital Architecture of the New ATLAS Pixel Chip FE-I4 |
title_sort | digital architecture of the new atlas pixel chip fe-i4 |
topic | Detectors and Experimental Techniques |
url | http://cds.cern.ch/record/1212960 |
work_keys_str_mv | AT barberom digitalarchitectureofthenewatlaspixelchipfei4 |