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Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade
3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the s...
Autores principales: | , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , |
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Lenguaje: | eng |
Publicado: |
2009
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.22323/1.098.0032 http://cds.cern.ch/record/1214038 |
_version_ | 1780918071162044416 |
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author | La Rosa, Alessandro Boscardin, M. Dalla Betta, G.-F. Darbo, G. Gemme, C. Pernegger, H. Piemonte, C. Povoli, M. Ronchin, S. Zoboli, A. Zorzi, N. Bolle, E. Borri, M. Da Via, C. Dong, S. Fazio, S. Grenier, P. Grinstein, S. Gjersdal, H. Hansson, P. Huegging, F. Jackson, P. Kocian, M. Rivero, F. Rohne, O. Sandaker, H. Sjobak, K. Slavicek, T. Tsung, W. Tsybychev, D. Wermes, N. Young, C. |
author_facet | La Rosa, Alessandro Boscardin, M. Dalla Betta, G.-F. Darbo, G. Gemme, C. Pernegger, H. Piemonte, C. Povoli, M. Ronchin, S. Zoboli, A. Zorzi, N. Bolle, E. Borri, M. Da Via, C. Dong, S. Fazio, S. Grenier, P. Grinstein, S. Gjersdal, H. Hansson, P. Huegging, F. Jackson, P. Kocian, M. Rivero, F. Rohne, O. Sandaker, H. Sjobak, K. Slavicek, T. Tsung, W. Tsybychev, D. Wermes, N. Young, C. |
author_sort | La Rosa, Alessandro |
collection | CERN |
description | 3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test. |
id | cern-1214038 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2009 |
record_format | invenio |
spelling | cern-12140382022-04-15T02:19:22Zdoi:10.22323/1.098.0032http://cds.cern.ch/record/1214038engLa Rosa, AlessandroBoscardin, M.Dalla Betta, G.-F.Darbo, G.Gemme, C.Pernegger, H.Piemonte, C.Povoli, M.Ronchin, S.Zoboli, A.Zorzi, N.Bolle, E.Borri, M.Da Via, C.Dong, S.Fazio, S.Grenier, P.Grinstein, S.Gjersdal, H.Hansson, P.Huegging, F.Jackson, P.Kocian, M.Rivero, F.Rohne, O.Sandaker, H.Sjobak, K.Slavicek, T.Tsung, W.Tsybychev, D.Wermes, N.Young, C.Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgradeDetectors and Experimental Techniques3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test.3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test.arXiv:0910.3788SLAC-PUB-14921oai:cds.cern.ch:12140382009-10-21 |
spellingShingle | Detectors and Experimental Techniques La Rosa, Alessandro Boscardin, M. Dalla Betta, G.-F. Darbo, G. Gemme, C. Pernegger, H. Piemonte, C. Povoli, M. Ronchin, S. Zoboli, A. Zorzi, N. Bolle, E. Borri, M. Da Via, C. Dong, S. Fazio, S. Grenier, P. Grinstein, S. Gjersdal, H. Hansson, P. Huegging, F. Jackson, P. Kocian, M. Rivero, F. Rohne, O. Sandaker, H. Sjobak, K. Slavicek, T. Tsung, W. Tsybychev, D. Wermes, N. Young, C. Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade |
title | Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade |
title_full | Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade |
title_fullStr | Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade |
title_full_unstemmed | Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade |
title_short | Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade |
title_sort | preliminary results of 3d-ddtc pixel detectors for the atlas upgrade |
topic | Detectors and Experimental Techniques |
url | https://dx.doi.org/10.22323/1.098.0032 http://cds.cern.ch/record/1214038 |
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