E-link: A Radiation-Hard Low-Power Electrical Link for Chip-to-Chip Communication

The e-link, an electrical interface suitable for transmission of data over PCBs or electrical cables, within a distance of a few meters, at data rates up to 320 Mbit/s, is presented. The elink is targeted for the connection between the GigaBit Transceiver (GBTX) chip and the Front-End (FE) integrate...

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Detalles Bibliográficos
Autores principales: Bonacini, S, Kloukinas, K, Moreira, P
Lenguaje:eng
Publicado: CERN 2009
Materias:
Engineering
Acceso en línea:https://dx.doi.org/10.5170/CERN-2009-006.422
http://cds.cern.ch/record/1235849
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author Bonacini, S
Kloukinas, K
Moreira, P
author_facet Bonacini, S
Kloukinas, K
Moreira, P
author_sort Bonacini, S
collection CERN
description The e-link, an electrical interface suitable for transmission of data over PCBs or electrical cables, within a distance of a few meters, at data rates up to 320 Mbit/s, is presented. The elink is targeted for the connection between the GigaBit Transceiver (GBTX) chip and the Front-End (FE) integrated circuits. A commercial component complying with the Scalable Low- Voltage Signaling (SLVS) electrical standard was tested and demonstrated a performance level compatible with our application. Test results are presented. A SLVS transmitter/receiver IP block was designed in 130 nm CMOS technology. A test chip was submitted for fabrication.
id cern-1235849
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2009
publisher CERN
record_format invenio
spelling cern-12358492019-09-30T06:29:59Zdoi:10.5170/CERN-2009-006.422http://cds.cern.ch/record/1235849engBonacini, SKloukinas, KMoreira, PE-link: A Radiation-Hard Low-Power Electrical Link for Chip-to-Chip CommunicationEngineeringThe e-link, an electrical interface suitable for transmission of data over PCBs or electrical cables, within a distance of a few meters, at data rates up to 320 Mbit/s, is presented. The elink is targeted for the connection between the GigaBit Transceiver (GBTX) chip and the Front-End (FE) integrated circuits. A commercial component complying with the Scalable Low- Voltage Signaling (SLVS) electrical standard was tested and demonstrated a performance level compatible with our application. Test results are presented. A SLVS transmitter/receiver IP block was designed in 130 nm CMOS technology. A test chip was submitted for fabrication.CERNoai:cds.cern.ch:12358492009
spellingShingle Engineering
Bonacini, S
Kloukinas, K
Moreira, P
E-link: A Radiation-Hard Low-Power Electrical Link for Chip-to-Chip Communication
title E-link: A Radiation-Hard Low-Power Electrical Link for Chip-to-Chip Communication
title_full E-link: A Radiation-Hard Low-Power Electrical Link for Chip-to-Chip Communication
title_fullStr E-link: A Radiation-Hard Low-Power Electrical Link for Chip-to-Chip Communication
title_full_unstemmed E-link: A Radiation-Hard Low-Power Electrical Link for Chip-to-Chip Communication
title_short E-link: A Radiation-Hard Low-Power Electrical Link for Chip-to-Chip Communication
title_sort e-link: a radiation-hard low-power electrical link for chip-to-chip communication
topic Engineering
url https://dx.doi.org/10.5170/CERN-2009-006.422
http://cds.cern.ch/record/1235849
work_keys_str_mv AT bonacinis elinkaradiationhardlowpowerelectricallinkforchiptochipcommunication
AT kloukinask elinkaradiationhardlowpowerelectricallinkforchiptochipcommunication
AT moreirap elinkaradiationhardlowpowerelectricallinkforchiptochipcommunication

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