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OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project

In late 2008, an international consortium for development of vertically integrated (3D) readout electronics was created to explore features available from this technology. In this paper, the OMEGAPIX circuit is presented. It is the first front-end ASIC prototype designed at LAL in 3D technology. It...

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Detalles Bibliográficos
Autores principales: Thienpont, D, Lounis, A, de La Taille, C, Seguin-Moreau, N, Martin-Chassard, G, Guo b, Y
Lenguaje:eng
Publicado: CERN 2009
Materias:
Acceso en línea:https://dx.doi.org/10.5170/CERN-2009-006.443
http://cds.cern.ch/record/1235854
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author Thienpont, D
Lounis, A
de La Taille, C
Seguin-Moreau, N
Martin-Chassard, G
Guo b, Y
author_facet Thienpont, D
Lounis, A
de La Taille, C
Seguin-Moreau, N
Martin-Chassard, G
Guo b, Y
author_sort Thienpont, D
collection CERN
description In late 2008, an international consortium for development of vertically integrated (3D) readout electronics was created to explore features available from this technology. In this paper, the OMEGAPIX circuit is presented. It is the first front-end ASIC prototype designed at LAL in 3D technology. It has been submitted on May 2009. At first, a short reminder of 3D technology is presented. Then the IC design is explained: analogue tier, digital tier and testability.
id cern-1235854
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2009
publisher CERN
record_format invenio
spelling cern-12358542019-09-30T06:29:59Zdoi:10.5170/CERN-2009-006.443http://cds.cern.ch/record/1235854engThienpont, DLounis, Ade La Taille, CSeguin-Moreau, NMartin-Chassard, GGuo b, YOMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel projectDetectors and Experimental TechniquesIn late 2008, an international consortium for development of vertically integrated (3D) readout electronics was created to explore features available from this technology. In this paper, the OMEGAPIX circuit is presented. It is the first front-end ASIC prototype designed at LAL in 3D technology. It has been submitted on May 2009. At first, a short reminder of 3D technology is presented. Then the IC design is explained: analogue tier, digital tier and testability.CERNoai:cds.cern.ch:12358542009
spellingShingle Detectors and Experimental Techniques
Thienpont, D
Lounis, A
de La Taille, C
Seguin-Moreau, N
Martin-Chassard, G
Guo b, Y
OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project
title OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project
title_full OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project
title_fullStr OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project
title_full_unstemmed OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project
title_short OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project
title_sort omegapix: 3d integrated circuit prototype dedicated to the atlas upgrade super lhc pixel project
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.5170/CERN-2009-006.443
http://cds.cern.ch/record/1235854
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