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OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project
In late 2008, an international consortium for development of vertically integrated (3D) readout electronics was created to explore features available from this technology. In this paper, the OMEGAPIX circuit is presented. It is the first front-end ASIC prototype designed at LAL in 3D technology. It...
Autores principales: | , , , , , |
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Lenguaje: | eng |
Publicado: |
CERN
2009
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.5170/CERN-2009-006.443 http://cds.cern.ch/record/1235854 |
_version_ | 1780918558319968256 |
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author | Thienpont, D Lounis, A de La Taille, C Seguin-Moreau, N Martin-Chassard, G Guo b, Y |
author_facet | Thienpont, D Lounis, A de La Taille, C Seguin-Moreau, N Martin-Chassard, G Guo b, Y |
author_sort | Thienpont, D |
collection | CERN |
description | In late 2008, an international consortium for development of vertically integrated (3D) readout electronics was created to explore features available from this technology. In this paper, the OMEGAPIX circuit is presented. It is the first front-end ASIC prototype designed at LAL in 3D technology. It has been submitted on May 2009. At first, a short reminder of 3D technology is presented. Then the IC design is explained: analogue tier, digital tier and testability. |
id | cern-1235854 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2009 |
publisher | CERN |
record_format | invenio |
spelling | cern-12358542019-09-30T06:29:59Zdoi:10.5170/CERN-2009-006.443http://cds.cern.ch/record/1235854engThienpont, DLounis, Ade La Taille, CSeguin-Moreau, NMartin-Chassard, GGuo b, YOMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel projectDetectors and Experimental TechniquesIn late 2008, an international consortium for development of vertically integrated (3D) readout electronics was created to explore features available from this technology. In this paper, the OMEGAPIX circuit is presented. It is the first front-end ASIC prototype designed at LAL in 3D technology. It has been submitted on May 2009. At first, a short reminder of 3D technology is presented. Then the IC design is explained: analogue tier, digital tier and testability.CERNoai:cds.cern.ch:12358542009 |
spellingShingle | Detectors and Experimental Techniques Thienpont, D Lounis, A de La Taille, C Seguin-Moreau, N Martin-Chassard, G Guo b, Y OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project |
title | OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project |
title_full | OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project |
title_fullStr | OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project |
title_full_unstemmed | OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project |
title_short | OMEGAPIX: 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project |
title_sort | omegapix: 3d integrated circuit prototype dedicated to the atlas upgrade super lhc pixel project |
topic | Detectors and Experimental Techniques |
url | https://dx.doi.org/10.5170/CERN-2009-006.443 http://cds.cern.ch/record/1235854 |
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