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The mechanics of solder alloy interconnects

Detalles Bibliográficos
Autores principales:	Frear, D R, Burchett, S N, Morgan, H S, Lau, J H
Lenguaje:	eng
Publicado:	Van Nostrand Reinhold 1994
Materias:	XX
Acceso en línea:	http://cds.cern.ch/record/1287084

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