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3D-FBK Pixel sensors: recent beam tests results with irradiated devices

The Pixel detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider (LHC), and plays a key role in the reconstruction of the primary and secondary vertices of short-lived particles. To cope with the high level of radiation produced during the collider operat...

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Autores principales: Micelli, A, Helle, K, Sandaker, H, Stugu, B, Barbero, M, Hugging, F, Karagounis, M, Kostyukhin, V, Kruger, H, Tsung, J W, Wermes, N, Capua, M, Fazio, S, Mastroberardino, A, Susinno, G, Gallrapp, C, Di Girolamo, B, Dobos, D, La Rosa, A, Pernegger, H, Roe, S, Slavicek, T, Pospisil, S, Jakobs, K, Kohler, M, Parzefall, U, Darbo, G, Gariano, G, Gemme, C, Rovani, A, Ruscino, E, Butter, C, Bates, R, Oshea, V, Parker, S, Cavalli-Sforza, M, Grinstein, S, Korokolov, I, Pradilla, C, Einsweiler, K, Garcia-Sciveres, M, Borri, M, Da Via, C, Freestone, J, Kolya, S, Lai, C H, Nellist, C, Pater, J, Thompson, R, Watts, S J, Hoeferkamp, M, Seidel, S, Bolle, E, Gjersdal, H, Sjobaek, K N, Stapnes, S, Rohne, O, Su, D, Young, C, Hansson, P, Grenier, P, Hasi, J, Kenney, C, Kocian, M, Jackson, P, Silverstein, D, Davetak, H, DeWilde, B, Tsybychev, D, Dalla Betta, G F, Gabos, P, Povoli, M, Cobal, M, Giordani, M P, Selmi, L, Cristofoli, A, Esseni, D, Palestri, P, Fleta, C, Lozano, M, Pellegrini, G, Boscardin, M, Bagolini, A, Piemonte, C, Ronchin, S, Zorzi, N, Hansen, T E, Hansen, T, Kok, A, Lietaer, N, Kalliopuska, J, Oja, A
Lenguaje:eng
Publicado: 2010
Materias:
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2010.12.209
http://cds.cern.ch/record/1313491
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author Micelli, A
Helle, K
Sandaker, H
Stugu, B
Barbero, M
Hugging, F
Karagounis, M
Kostyukhin, V
Kruger, H
Tsung, J W
Wermes, N
Capua, M
Fazio, S
Mastroberardino, A
Susinno, G
Gallrapp, C
Di Girolamo, B
Dobos, D
La Rosa, A
Pernegger, H
Roe, S
Slavicek, T
Pospisil, S
Jakobs, K
Kohler, M
Parzefall, U
Darbo, G
Gariano, G
Gemme, C
Rovani, A
Ruscino, E
Butter, C
Bates, R
Oshea, V
Parker, S
Cavalli-Sforza, M
Grinstein, S
Korokolov, I
Pradilla, C
Einsweiler, K
Garcia-Sciveres, M
Borri, M
Da Via, C
Freestone, J
Kolya, S
Lai, C H
Nellist, C
Pater, J
Thompson, R
Watts, S J
Hoeferkamp, M
Seidel, S
Bolle, E
Gjersdal, H
Sjobaek, K N
Stapnes, S
Rohne, O
Su, D
Young, C
Hansson, P
Grenier, P
Hasi, J
Kenney, C
Kocian, M
Jackson, P
Silverstein, D
Davetak, H
DeWilde, B
Tsybychev, D
Dalla Betta, G F
Gabos, P
Povoli, M
Cobal, M
Giordani, M P
Selmi, L
Cristofoli, A
Esseni, D
Palestri, P
Fleta, C
Lozano, M
Pellegrini, G
Boscardin, M
Bagolini, A
Piemonte, C
Ronchin, S
Zorzi, N
Hansen, T E
Hansen, T
Kok, A
Lietaer, N
Kalliopuska, J
Oja, A
author_facet Micelli, A
Helle, K
Sandaker, H
Stugu, B
Barbero, M
Hugging, F
Karagounis, M
Kostyukhin, V
Kruger, H
Tsung, J W
Wermes, N
Capua, M
Fazio, S
Mastroberardino, A
Susinno, G
Gallrapp, C
Di Girolamo, B
Dobos, D
La Rosa, A
Pernegger, H
Roe, S
Slavicek, T
Pospisil, S
Jakobs, K
Kohler, M
Parzefall, U
Darbo, G
Gariano, G
Gemme, C
Rovani, A
Ruscino, E
Butter, C
Bates, R
Oshea, V
Parker, S
Cavalli-Sforza, M
Grinstein, S
Korokolov, I
Pradilla, C
Einsweiler, K
Garcia-Sciveres, M
Borri, M
Da Via, C
Freestone, J
Kolya, S
Lai, C H
Nellist, C
Pater, J
Thompson, R
Watts, S J
Hoeferkamp, M
Seidel, S
Bolle, E
Gjersdal, H
Sjobaek, K N
Stapnes, S
Rohne, O
Su, D
Young, C
Hansson, P
Grenier, P
Hasi, J
Kenney, C
Kocian, M
Jackson, P
Silverstein, D
Davetak, H
DeWilde, B
Tsybychev, D
Dalla Betta, G F
Gabos, P
Povoli, M
Cobal, M
Giordani, M P
Selmi, L
Cristofoli, A
Esseni, D
Palestri, P
Fleta, C
Lozano, M
Pellegrini, G
Boscardin, M
Bagolini, A
Piemonte, C
Ronchin, S
Zorzi, N
Hansen, T E
Hansen, T
Kok, A
Lietaer, N
Kalliopuska, J
Oja, A
author_sort Micelli, A
collection CERN
description The Pixel detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider (LHC), and plays a key role in the reconstruction of the primary and secondary vertices of short-lived particles. To cope with the high level of radiation produced during the collider operation, it is planned to add to the present three layers of silicon pixel sensors which constitute the Pixel Detector, an additional layer (Insertable B-Layer, or IBL) of sensors. 3D silicon sensors are one of the technologies which are under study for the IBL. 3D silicon technology is an innovative combination of very-large-scale integration (VLSI) and Micro-Electro-Mechanical-Systems (MEMS) where electrodes are fabricated inside the silicon bulk instead of being implanted on the wafer surfaces. 3D sensors, with electrodes fully or partially penetrating the silicon substrate, are currently fabricated at different processing facilities in Europe and USA. This paper reports on the 2010 June beam test results for irradiated 3D devices produced at FBK (Trento, Italy). The performance of these devices, all bump-bonded with the ATLAS pixel FE-I3 readout chip, is compared to that observed before irradiation in a previous beam test.
id cern-1313491
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2010
record_format invenio
spelling cern-13134912019-09-30T06:29:59Zdoi:10.1016/j.nima.2010.12.209http://cds.cern.ch/record/1313491engMicelli, AHelle, KSandaker, HStugu, BBarbero, MHugging, FKaragounis, MKostyukhin, VKruger, HTsung, J WWermes, NCapua, MFazio, SMastroberardino, ASusinno, GGallrapp, CDi Girolamo, BDobos, DLa Rosa, APernegger, HRoe, SSlavicek, TPospisil, SJakobs, KKohler, MParzefall, UDarbo, GGariano, GGemme, CRovani, ARuscino, EButter, CBates, ROshea, VParker, SCavalli-Sforza, MGrinstein, SKorokolov, IPradilla, CEinsweiler, KGarcia-Sciveres, MBorri, MDa Via, CFreestone, JKolya, SLai, C HNellist, CPater, JThompson, RWatts, S JHoeferkamp, MSeidel, SBolle, EGjersdal, HSjobaek, K NStapnes, SRohne, OSu, DYoung, CHansson, PGrenier, PHasi, JKenney, CKocian, MJackson, PSilverstein, DDavetak, HDeWilde, BTsybychev, DDalla Betta, G FGabos, PPovoli, MCobal, MGiordani, M PSelmi, LCristofoli, AEsseni, DPalestri, PFleta, CLozano, MPellegrini, GBoscardin, MBagolini, APiemonte, CRonchin, SZorzi, NHansen, T EHansen, TKok, ALietaer, NKalliopuska, JOja, A3D-FBK Pixel sensors: recent beam tests results with irradiated devicesDetectors and Experimental TechniquesThe Pixel detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider (LHC), and plays a key role in the reconstruction of the primary and secondary vertices of short-lived particles. To cope with the high level of radiation produced during the collider operation, it is planned to add to the present three layers of silicon pixel sensors which constitute the Pixel Detector, an additional layer (Insertable B-Layer, or IBL) of sensors. 3D silicon sensors are one of the technologies which are under study for the IBL. 3D silicon technology is an innovative combination of very-large-scale integration (VLSI) and Micro-Electro-Mechanical-Systems (MEMS) where electrodes are fabricated inside the silicon bulk instead of being implanted on the wafer surfaces. 3D sensors, with electrodes fully or partially penetrating the silicon substrate, are currently fabricated at different processing facilities in Europe and USA. This paper reports on the 2010 June beam test results for irradiated 3D devices produced at FBK (Trento, Italy). The performance of these devices, all bump-bonded with the ATLAS pixel FE-I3 readout chip, is compared to that observed before irradiation in a previous beam test.ATL-INDET-PROC-2010-044oai:cds.cern.ch:13134912010-12-11
spellingShingle Detectors and Experimental Techniques
Micelli, A
Helle, K
Sandaker, H
Stugu, B
Barbero, M
Hugging, F
Karagounis, M
Kostyukhin, V
Kruger, H
Tsung, J W
Wermes, N
Capua, M
Fazio, S
Mastroberardino, A
Susinno, G
Gallrapp, C
Di Girolamo, B
Dobos, D
La Rosa, A
Pernegger, H
Roe, S
Slavicek, T
Pospisil, S
Jakobs, K
Kohler, M
Parzefall, U
Darbo, G
Gariano, G
Gemme, C
Rovani, A
Ruscino, E
Butter, C
Bates, R
Oshea, V
Parker, S
Cavalli-Sforza, M
Grinstein, S
Korokolov, I
Pradilla, C
Einsweiler, K
Garcia-Sciveres, M
Borri, M
Da Via, C
Freestone, J
Kolya, S
Lai, C H
Nellist, C
Pater, J
Thompson, R
Watts, S J
Hoeferkamp, M
Seidel, S
Bolle, E
Gjersdal, H
Sjobaek, K N
Stapnes, S
Rohne, O
Su, D
Young, C
Hansson, P
Grenier, P
Hasi, J
Kenney, C
Kocian, M
Jackson, P
Silverstein, D
Davetak, H
DeWilde, B
Tsybychev, D
Dalla Betta, G F
Gabos, P
Povoli, M
Cobal, M
Giordani, M P
Selmi, L
Cristofoli, A
Esseni, D
Palestri, P
Fleta, C
Lozano, M
Pellegrini, G
Boscardin, M
Bagolini, A
Piemonte, C
Ronchin, S
Zorzi, N
Hansen, T E
Hansen, T
Kok, A
Lietaer, N
Kalliopuska, J
Oja, A
3D-FBK Pixel sensors: recent beam tests results with irradiated devices
title 3D-FBK Pixel sensors: recent beam tests results with irradiated devices
title_full 3D-FBK Pixel sensors: recent beam tests results with irradiated devices
title_fullStr 3D-FBK Pixel sensors: recent beam tests results with irradiated devices
title_full_unstemmed 3D-FBK Pixel sensors: recent beam tests results with irradiated devices
title_short 3D-FBK Pixel sensors: recent beam tests results with irradiated devices
title_sort 3d-fbk pixel sensors: recent beam tests results with irradiated devices
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.1016/j.nima.2010.12.209
http://cds.cern.ch/record/1313491
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