Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were perfor...

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Detalles Bibliográficos
Autores principales: Grenier, P., Alimonti, G., Barbero, M., Bates, R., Bolle, E., Borri, M., Boscardin, M., Buttar, C., Capua, M., Cavalli-Sforza, M., Cobal, M., Cristofoli, A., Dalla Betta, G.F., Darbo, G., Da Via, C., Devetak, E., DeWilde, B., Di Girolamo, B., Dobos, D., Einsweiler, K., Esseni, D., Fazio, S., Fleta, C., Freestone, J., Gallrapp, C., Garcia-Sciveres, M., Gariano, G., Gemme, C., Giordani, M.P., Gjersdal, H., Grinstein, S., Hansen, T., Hansen, T.E., Hansson, P., Hasi, J., Helle, K., Hoeferkamp, M., Hugging, F., Jackson, P., Jakobs, K., Kalliopuska, J., Karagounis, M., Kenney, C., Kohler, M., Kocian, M., Kok, A., Kolya, S., Korokolov, I., Kostyukhin, V., Kruger, H., La Rosa, A., Lai, C.H., Lietaer, N., Lozano, M., Mastroberardino, A., Micelli, A., Nellist, C., Oja, A., Oshea, V., Padilla, C., Palestri, P., Parker, S., Parzefall, U., Pater, J., Pellegrini, G., Pernegger, H., Piemonte, C., Pospisil, S., Povoli, M., Roe, S., Rohne, O., Ronchin, S., Rovani, A., Ruscino, E., Sandaker, H., Seidel, S., Selmi, L., Silverstein, D., Sjobaek, K., Slavicek, T., Stapnes, S., Stugu, B., Stupak, J., Su, D., Susinno, G., Thompson, R., Tsung, J.W., Tsybychev, D., Watts, S.J., Wermes, N., Young, C., Zorzi, N.
Lenguaje:eng
Publicado: 2011
Materias:
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2011.01.181
http://cds.cern.ch/record/1324069
Descripción
Sumario:Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

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