Cargando…
Characterization of Thin Pixel Sensor Modules Interconnected with SLID Technology Irradiated to a Fluence of 2$\cdot 10^{15}$\,n$_{\mathrm{eq}}$/cm$^2$
A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out via Inter Chip Vias (ICV) etched through the front-end. Thi...
| Autores principales: | , , , , , , |
|---|---|
| Lenguaje: | eng |
| Publicado: |
2011
|
| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1088/1748-0221/6/12/C12049 http://cds.cern.ch/record/1382836 |