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Evolution of surface topography in dependence on the grain orientation during surface thermal fatigue of polycrystalline copper
Surface degradation due to cyclic thermal loading plays a major role in the Accelerating Structures (AS) of the future Compact Linear Collider (CLIC) In this article results on surface degradation of thermally cycled polycrystalline copper as a function of the orientation of surface grains are prese...
| Autores principales: | , , , , , , |
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| Lenguaje: | eng |
| Publicado: |
2011
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1016/j.ijfatigue.2010.09.015 http://cds.cern.ch/record/1399854 |