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3D silicon pixel sensors: Recent test beam results
The 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified...
| Autores principales: | , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , |
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| Lenguaje: | eng |
| Publicado: |
2011
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1016/j.nima.2010.06.321 http://cds.cern.ch/record/1399865 |
| _version_ | 1780923639003086848 |
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| author | Hansson, P Gjersdal, H Sandaker, H Korolkov, I Barrera, C Wermes, N Borri, M Grinstein, S Troyano, I Grenier, P Devetak, E Fleta, C Kenney, C Tsybychev, D Nellist, C Chmeissan, M Su, D DeWilde, B Silverstein, D Dorholt, O Tsung, J Sjoebaek, K Stupak, J Slaviec, T Micelli, A Helle, K Bolle, E Huegging, F Kocian, M Fazio, S Balbuena, J Dalla Betta, G F La Rosa, A Rivero, F Mastroberardino, A Hasi, J Darbo, G Boscardin, M Da Via, C Nordahl, P Giordani, M Jackson, P Rohne, O Gemme, C Young, C |
| author_facet | Hansson, P Gjersdal, H Sandaker, H Korolkov, I Barrera, C Wermes, N Borri, M Grinstein, S Troyano, I Grenier, P Devetak, E Fleta, C Kenney, C Tsybychev, D Nellist, C Chmeissan, M Su, D DeWilde, B Silverstein, D Dorholt, O Tsung, J Sjoebaek, K Stupak, J Slaviec, T Micelli, A Helle, K Bolle, E Huegging, F Kocian, M Fazio, S Balbuena, J Dalla Betta, G F La Rosa, A Rivero, F Mastroberardino, A Hasi, J Darbo, G Boscardin, M Da Via, C Nordahl, P Giordani, M Jackson, P Rohne, O Gemme, C Young, C |
| author_sort | Hansson, P |
| collection | CERN |
| description | The 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified-3D assemblies fabricated at FBK-irst with partially overlapping electrodes. In both cases three read-out electrodes are ganged together to form pixels of dimension 50 x 400 mu m(2). Data on the pulse height distribution, tracking efficiency and resolution were collected for various particle incident angles, with and without a 1.6 T magnetic field. Data from a planar sensor of the type presently used in the ATLAS detector were used at the same time to give comparison. Published by Elsevier B.V. |
| id | cern-1399865 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2011 |
| record_format | invenio |
| spelling | cern-13998652019-09-30T06:29:59Zdoi:10.1016/j.nima.2010.06.321http://cds.cern.ch/record/1399865engHansson, PGjersdal, HSandaker, HKorolkov, IBarrera, CWermes, NBorri, MGrinstein, STroyano, IGrenier, PDevetak, EFleta, CKenney, CTsybychev, DNellist, CChmeissan, MSu, DDeWilde, BSilverstein, DDorholt, OTsung, JSjoebaek, KStupak, JSlaviec, TMicelli, AHelle, KBolle, EHuegging, FKocian, MFazio, SBalbuena, JDalla Betta, G FLa Rosa, ARivero, FMastroberardino, AHasi, JDarbo, GBoscardin, MDa Via, CNordahl, PGiordani, MJackson, PRohne, OGemme, CYoung, C3D silicon pixel sensors: Recent test beam resultsDetectors and Experimental TechniquesThe 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified-3D assemblies fabricated at FBK-irst with partially overlapping electrodes. In both cases three read-out electrodes are ganged together to form pixels of dimension 50 x 400 mu m(2). Data on the pulse height distribution, tracking efficiency and resolution were collected for various particle incident angles, with and without a 1.6 T magnetic field. Data from a planar sensor of the type presently used in the ATLAS detector were used at the same time to give comparison. Published by Elsevier B.V.oai:cds.cern.ch:13998652011 |
| spellingShingle | Detectors and Experimental Techniques Hansson, P Gjersdal, H Sandaker, H Korolkov, I Barrera, C Wermes, N Borri, M Grinstein, S Troyano, I Grenier, P Devetak, E Fleta, C Kenney, C Tsybychev, D Nellist, C Chmeissan, M Su, D DeWilde, B Silverstein, D Dorholt, O Tsung, J Sjoebaek, K Stupak, J Slaviec, T Micelli, A Helle, K Bolle, E Huegging, F Kocian, M Fazio, S Balbuena, J Dalla Betta, G F La Rosa, A Rivero, F Mastroberardino, A Hasi, J Darbo, G Boscardin, M Da Via, C Nordahl, P Giordani, M Jackson, P Rohne, O Gemme, C Young, C 3D silicon pixel sensors: Recent test beam results |
| title | 3D silicon pixel sensors: Recent test beam results |
| title_full | 3D silicon pixel sensors: Recent test beam results |
| title_fullStr | 3D silicon pixel sensors: Recent test beam results |
| title_full_unstemmed | 3D silicon pixel sensors: Recent test beam results |
| title_short | 3D silicon pixel sensors: Recent test beam results |
| title_sort | 3d silicon pixel sensors: recent test beam results |
| topic | Detectors and Experimental Techniques |
| url | https://dx.doi.org/10.1016/j.nima.2010.06.321 http://cds.cern.ch/record/1399865 |
| work_keys_str_mv | AT hanssonp 3dsiliconpixelsensorsrecenttestbeamresults AT gjersdalh 3dsiliconpixelsensorsrecenttestbeamresults AT sandakerh 3dsiliconpixelsensorsrecenttestbeamresults AT korolkovi 3dsiliconpixelsensorsrecenttestbeamresults AT barrerac 3dsiliconpixelsensorsrecenttestbeamresults AT wermesn 3dsiliconpixelsensorsrecenttestbeamresults AT borrim 3dsiliconpixelsensorsrecenttestbeamresults AT grinsteins 3dsiliconpixelsensorsrecenttestbeamresults AT troyanoi 3dsiliconpixelsensorsrecenttestbeamresults AT grenierp 3dsiliconpixelsensorsrecenttestbeamresults AT devetake 3dsiliconpixelsensorsrecenttestbeamresults AT fletac 3dsiliconpixelsensorsrecenttestbeamresults AT kenneyc 3dsiliconpixelsensorsrecenttestbeamresults AT tsybychevd 3dsiliconpixelsensorsrecenttestbeamresults AT nellistc 3dsiliconpixelsensorsrecenttestbeamresults AT chmeissanm 3dsiliconpixelsensorsrecenttestbeamresults AT sud 3dsiliconpixelsensorsrecenttestbeamresults AT dewildeb 3dsiliconpixelsensorsrecenttestbeamresults AT silversteind 3dsiliconpixelsensorsrecenttestbeamresults AT dorholto 3dsiliconpixelsensorsrecenttestbeamresults AT tsungj 3dsiliconpixelsensorsrecenttestbeamresults AT sjoebaekk 3dsiliconpixelsensorsrecenttestbeamresults AT stupakj 3dsiliconpixelsensorsrecenttestbeamresults AT slaviect 3dsiliconpixelsensorsrecenttestbeamresults AT micellia 3dsiliconpixelsensorsrecenttestbeamresults AT hellek 3dsiliconpixelsensorsrecenttestbeamresults AT bollee 3dsiliconpixelsensorsrecenttestbeamresults AT hueggingf 3dsiliconpixelsensorsrecenttestbeamresults AT kocianm 3dsiliconpixelsensorsrecenttestbeamresults AT fazios 3dsiliconpixelsensorsrecenttestbeamresults AT balbuenaj 3dsiliconpixelsensorsrecenttestbeamresults AT dallabettagf 3dsiliconpixelsensorsrecenttestbeamresults AT larosaa 3dsiliconpixelsensorsrecenttestbeamresults AT riverof 3dsiliconpixelsensorsrecenttestbeamresults AT mastroberardinoa 3dsiliconpixelsensorsrecenttestbeamresults AT hasij 3dsiliconpixelsensorsrecenttestbeamresults AT darbog 3dsiliconpixelsensorsrecenttestbeamresults AT boscardinm 3dsiliconpixelsensorsrecenttestbeamresults AT daviac 3dsiliconpixelsensorsrecenttestbeamresults AT nordahlp 3dsiliconpixelsensorsrecenttestbeamresults AT giordanim 3dsiliconpixelsensorsrecenttestbeamresults AT jacksonp 3dsiliconpixelsensorsrecenttestbeamresults AT rohneo 3dsiliconpixelsensorsrecenttestbeamresults AT gemmec 3dsiliconpixelsensorsrecenttestbeamresults AT youngc 3dsiliconpixelsensorsrecenttestbeamresults |