The FE-I4 Pixel Readout Chip and the IBL Module

FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus s...

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Autores principales: Barbero, Marlon, Arutinov, David, Backhaus, Malte, Fang, Xiaochao, Gonella, Laura, Hemperek, Tomasz, Karagounis, Michael, Krueger, Hans, Kruth, Andre, Wermes, Norbert, Breugnon, Patrick, Fougeron, Denis, Gensolen, Fabrice, Menouni, Mohsine, Rozanov, Sasha, Caminada, Lea, Dube, Sourabh, Fleury, Julien, Gnani, Dario, Garcia-Sciveres, Maurice, Jensen, Frank, Lu, Yunpeng, Mekkaoui, Abderrezak, Gromov, Vladimir, Kluit, Ruud, Schipper, Jan David, Zivkovic, Vladimir, Grosse-Knetter, Joern, Weingarten, Kocian, Martin
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: Proceedings of Science 2011
Materias:
Detectors and Experimental Techniques
9: Advanced infrastructures for detector R&D
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
9.3: Precision Pixel Detectors
9.4: Silicon Tracking Devices
Acceso en línea:http://cds.cern.ch/record/1405045
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author Barbero, Marlon
Arutinov, David
Backhaus, Malte
Fang, Xiaochao
Gonella, Laura
Hemperek, Tomasz
Karagounis, Michael
Krueger, Hans
Kruth, Andre
Wermes, Norbert
Breugnon, Patrick
Fougeron, Denis
Gensolen, Fabrice
Menouni, Mohsine
Rozanov, Sasha
Caminada, Lea
Dube, Sourabh
Fleury, Julien
Gnani, Dario
Garcia-Sciveres, Maurice
Jensen, Frank
Lu, Yunpeng
Mekkaoui, Abderrezak
Gromov, Vladimir
Kluit, Ruud
Schipper, Jan David
Zivkovic, Vladimir
Grosse-Knetter, Joern
Weingarten
Kocian, Martin
author_facet Barbero, Marlon
Arutinov, David
Backhaus, Malte
Fang, Xiaochao
Gonella, Laura
Hemperek, Tomasz
Karagounis, Michael
Krueger, Hans
Kruth, Andre
Wermes, Norbert
Breugnon, Patrick
Fougeron, Denis
Gensolen, Fabrice
Menouni, Mohsine
Rozanov, Sasha
Caminada, Lea
Dube, Sourabh
Fleury, Julien
Gnani, Dario
Garcia-Sciveres, Maurice
Jensen, Frank
Lu, Yunpeng
Mekkaoui, Abderrezak
Gromov, Vladimir
Kluit, Ruud
Schipper, Jan David
Zivkovic, Vladimir
Grosse-Knetter, Joern
Weingarten
Kocian, Martin
author_sort Barbero, Marlon
collection CERN
description FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus suitable for intermediate radii pixel detector layers in the High Luminosity LHC environment, but also for the inserted layer at 3.3 cm known as the “Insertable B-Layer” project (IBL), at a shorter timescale. In this paper, an introduction to the FE-I4 will be given, focusing on test results from the first full size FE-I4A prototype which has been available since fall 2010. The IBL project will be introduced, with particular emphasis on the FE-I4-based module concept.
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spelling cern-14050452019-09-30T06:29:59Z http://cds.cern.ch/record/1405045 eng Barbero, Marlon Arutinov, David Backhaus, Malte Fang, Xiaochao Gonella, Laura Hemperek, Tomasz Karagounis, Michael Krueger, Hans Kruth, Andre Wermes, Norbert Breugnon, Patrick Fougeron, Denis Gensolen, Fabrice Menouni, Mohsine Rozanov, Sasha Caminada, Lea Dube, Sourabh Fleury, Julien Gnani, Dario Garcia-Sciveres, Maurice Jensen, Frank Lu, Yunpeng Mekkaoui, Abderrezak Gromov, Vladimir Kluit, Ruud Schipper, Jan David Zivkovic, Vladimir Grosse-Knetter, Joern Weingarten Kocian, Martin The FE-I4 Pixel Readout Chip and the IBL Module Detectors and Experimental Techniques 9: Advanced infrastructures for detector R&D 3: Microelectronics and interconnection technology 3.2: 3D Interconnection 9.3: Precision Pixel Detectors 9.4: Silicon Tracking Devices FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus suitable for intermediate radii pixel detector layers in the High Luminosity LHC environment, but also for the inserted layer at 3.3 cm known as the “Insertable B-Layer” project (IBL), at a shorter timescale. In this paper, an introduction to the FE-I4 will be given, focusing on test results from the first full size FE-I4A prototype which has been available since fall 2010. The IBL project will be introduced, with particular emphasis on the FE-I4-based module concept. info:eu-repo/grantAgreement/EC/FP7/262025 info:eu-repo/semantics/openAccess Education Level info:eu-repo/semantics/article http://cds.cern.ch/record/1405045 Proceedings of Science Proceedings of Science, () pp. 2011
spellingShingle Detectors and Experimental Techniques
9: Advanced infrastructures for detector R&D
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
9.3: Precision Pixel Detectors
9.4: Silicon Tracking Devices
Barbero, Marlon
Arutinov, David
Backhaus, Malte
Fang, Xiaochao
Gonella, Laura
Hemperek, Tomasz
Karagounis, Michael
Krueger, Hans
Kruth, Andre
Wermes, Norbert
Breugnon, Patrick
Fougeron, Denis
Gensolen, Fabrice
Menouni, Mohsine
Rozanov, Sasha
Caminada, Lea
Dube, Sourabh
Fleury, Julien
Gnani, Dario
Garcia-Sciveres, Maurice
Jensen, Frank
Lu, Yunpeng
Mekkaoui, Abderrezak
Gromov, Vladimir
Kluit, Ruud
Schipper, Jan David
Zivkovic, Vladimir
Grosse-Knetter, Joern
Weingarten
Kocian, Martin
The FE-I4 Pixel Readout Chip and the IBL Module
title The FE-I4 Pixel Readout Chip and the IBL Module
title_full The FE-I4 Pixel Readout Chip and the IBL Module
title_fullStr The FE-I4 Pixel Readout Chip and the IBL Module
title_full_unstemmed The FE-I4 Pixel Readout Chip and the IBL Module
title_short The FE-I4 Pixel Readout Chip and the IBL Module
title_sort fe-i4 pixel readout chip and the ibl module
topic Detectors and Experimental Techniques
9: Advanced infrastructures for detector R&D
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
9.3: Precision Pixel Detectors
9.4: Silicon Tracking Devices
url http://cds.cern.ch/record/1405045
http://cds.cern.ch/record/1405045
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