Cargando…

Pixel 2010: A résumé

The Pixel 2010 conference focused on semiconductor pixel detectors for particle tracking/vertexing as well as for imaging, in particular for synchrotron light sources and XFELs. The big LHC hybrid pixel detectors have impressively started showing their capabilities. X-ray imaging detectors, also usi...

Descripción completa

Detalles Bibliográficos
Autor principal:	Wermes, Norbert
Formato:	info:eu-repo/semantics/article
Lenguaje:	eng
Publicado:	Nucl. Instrum. Methods Phys. Res., A 2011
Materias:	Detectors and Experimental Techniques 9: Advanced infrastructures for detector R&D 3: Microelectronics and interconnection technology 3.2: 3D Interconnection 9.3: Precision Pixel Detectors 9.4: Silicon Tracking Devices
Acceso en línea:	http://cds.cern.ch/record/1405438

Ejemplares similares

The FE-I4 Pixel Readout Chip and the IBL Module
por: Barbero, Marlon, et al.
Publicado: (2011)

L'infection sévère par SARS-CoV-2 comme marqueur d'un cancer non diagnostiqué - une étude populationnelle - France
por: Dugerdil, A., et al.
Publicado: (2023)

A via last TSV process applied to ATLAS pixel detector modules: proof of principle demonstration
por: Barbero, M, et al.
Publicado: (2012)

Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC
por: Aruntinov, D, et al.
Publicado: (2013)

Test results of the first 3D-IC prototype chip developed in the framework of HL-LHC/ATLAS hybrid pixel upgrade
por: Pangaud, P, et al.
Publicado: (2014)

Status and perspectives of pixel sensors based on 3D vertical integration
por: Re, V
Publicado: (2014)

Flip chip assembly of thinned chips for hybrid pixel detector applications
por: Fritzsch, T, et al.
Publicado: (2014)

Production and characterization of SLID interconnected n-in-p pixel modules with 75 micron thin silicon sensors
por: Andricek, L, et al.
Publicado: (2014)

Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies
por: Macchiolo, A., et al.
Publicado: (2013)

Production and characterisation of SLID interconnected n-in-p pixel modules with 75 μm thin silicon sensors
por: Andricek, L, et al.
Publicado: (2014)

3D integration of Geiger-mode avalanche photodiodes aimed to very high fill-factor pixels for future linear colliders
por: Vilella, E, et al.
Publicado: (2013)

Characterization of Thin Pixel Sensor Modules Interconnected with SLID Technology Irradiated to a Fluence of 2⋅10 15 $n_{eq}$ /cm 2
por: Weigell, P, et al.
Publicado: (2011)

Enable access to 3D interconnection technology
por: Moser, H-G.
Publicado: (2015)

CMOS MAPS in a Homogeneous 3D Process for Charged Particle Tracking
por: Manazza, A, et al.
Publicado: (2014)

Assessment of 3D integrated sensors
por: Moser, H.-G.
Publicado: (2015)

A test beam set-up for the characterization of the Geiger-mode avalanche photodiode technology for particle tracking
por: Vilella, A, et al.
Publicado: (2012)

Component Processing
por: Re, V.
Publicado: (2013)

Geiger-Mode Avalanche Photodiodes in Particle Detection
por: Vilella, E, et al.
Publicado: (2012)

Recent progress in the development of 3D deep n-well CMOS MAPS
por: Traversi, Gianluca, et al.
Publicado: (2012)

The SuperB Silicon Vertex Tracker and 3D vertical integration
por: Re, Valerio
Publicado: (2011)

ORGANISATION OF THE 3D PRODUCTION
por: Re, Valerio
Publicado: (2012)

PRODUCTION OF DEDICATED SENSORS
por: Moser, Hans-Günther
Publicado: (2012)

AVAILABILITY OF WAFERS OF ASIC ELECTRONICS
por: Valerio, Re
Publicado: (2012)

WAFER POSTPROCESSING (THINNING, TSV)
por: Moser, Hans-Gunther
Publicado: (2013)

QUALIFICATION OF ASIC AND SENSORS FOR 3D INTERCONNECTION
por: Re, Valerio
Publicado: (2013)

Test interconnection and evaluation:
por: Re, V.
Publicado: (2014)

3D interconnection processing accomplished
por: Re, V.
Publicado: (2014)

Development of scalable frequency and power Phase-Locked Loop in 130nm CMOS technology
por: Firlej, M, et al.
Publicado: (2014)

Perspectives of 65 nm CMOS technologies for high performance front-end electronics
por: Traversi, G, et al.
Publicado: (2014)

Tests of the First Three-Dimensionally Integrated
por: Maj, P, et al.
Publicado: (2014)

3D Interconnection with TSV
por: Moser, H-G
Publicado: (2014)

The path towards the application of new microelectronic technologies in the AIDA community
por: Re, V
Publicado: (2013)

Through Silicon Via Redistribution of I/O Pads
por: Seller, P, et al.
Publicado: (2012)

Detectors in 3D available for assessment
por: Re, Valerio
Publicado: (2014)

Evaporative CO$_2$ microchannel cooling for the LHCb VELO Pixel Upgrade
por: De Aguiar Francisco, Oscar Augusto
Publicado: (2014)

SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades
por: Macchiolo, A., et al.
Publicado: (2012)

Pixel party
por: Vos, Marcel, et al.
Publicado: (2014)

R&D Paths of Pixel Detectors for Vertex Tracking and Radiation Imaging
por: Battaglia, Marco, et al.
Publicado: (2013)

Upgrades of the ATLAS Pixel Detector
por: Hügging, F
Publicado: (2015)

An EUDET/AIDA Pixel Beam Telescope for Detector Development
por: Rubinskiy, I, et al.
Publicado: (2015)

Cannot write session to /tmp/vufind_sessions/sess_ci9m59s86m6f54tcei8svcgj2v