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Reliability Tests of Aluminium Wedge Wire Bonding on Auto-catalytic Silver Immersion Gold (ASIG) PCB Metallization

The Auto-catalytic Silver Immersion Gold (ASIG) PCB metallization is a new process that has clear advantages for PCB assembly especially with regard to lead-free soldering. As it may become a popular process in the future for electronics used in physics experiments, the quality of this metallization...

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Detalles Bibliográficos
Autores principales:	Drozd, A, Honma, A, Kaufmann, S, Manolescu, F, McGill, I
Publicado:	2011
Materias:	Detectors and Experimental Techniques
Acceso en línea:	http://cds.cern.ch/record/1408696

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