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The SuperB Silicon Vertex Tracker and 3D vertical integration
The construction of the SuperB high luminosity collider was approved and funded by the Italian government in 2011. The performance specifications set by the target luminosity of this machine (> 10^36 cm^-2 s^-1) ask for the development of a Silicon Vertex Tracker with high resolution, high tolera...
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Formato: | info:eu-repo/semantics/article |
Lenguaje: | eng |
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PoS
2011
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Acceso en línea: | http://cds.cern.ch/record/1426296 |
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author | Re, Valerio |
author_facet | Re, Valerio |
author_sort | Re, Valerio |
collection | CERN |
description | The construction of the SuperB high luminosity collider was approved and funded by the Italian government in 2011. The performance specifications set by the target luminosity of this machine (> 10^36 cm^-2 s^-1) ask for the development of a Silicon Vertex Tracker with high resolution, high tolerance to radiation and excellent capability of handling high data rates. This paper reviews the R&D activity that is being carried out for the SuperB SVT. Special emphasis is given to the option of exploiting 3D vertical integration to build advanced pixel sensors and readout electronics that are able to comply with SuperB vertexing requirements. |
format | info:eu-repo/semantics/article |
id | cern-1426296 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2011 |
publisher | PoS |
record_format | invenio |
spelling | cern-14262962019-09-30T06:29:59Z http://cds.cern.ch/record/1426296 eng Re, Valerio The SuperB Silicon Vertex Tracker and 3D vertical integration Detectors and Experimental Techniques 3: Microelectronics and interconnection technology 3.2: 3D Interconnection The construction of the SuperB high luminosity collider was approved and funded by the Italian government in 2011. The performance specifications set by the target luminosity of this machine (> 10^36 cm^-2 s^-1) ask for the development of a Silicon Vertex Tracker with high resolution, high tolerance to radiation and excellent capability of handling high data rates. This paper reviews the R&D activity that is being carried out for the SuperB SVT. Special emphasis is given to the option of exploiting 3D vertical integration to build advanced pixel sensors and readout electronics that are able to comply with SuperB vertexing requirements. info:eu-repo/grantAgreement/EC/FP7/262025 info:eu-repo/semantics/openAccess Education Level info:eu-repo/semantics/article http://cds.cern.ch/record/1426296 PoS PoS, (2011) pp. 023 2011 |
spellingShingle | Detectors and Experimental Techniques 3: Microelectronics and interconnection technology 3.2: 3D Interconnection Re, Valerio The SuperB Silicon Vertex Tracker and 3D vertical integration |
title | The SuperB Silicon Vertex Tracker and 3D vertical integration |
title_full | The SuperB Silicon Vertex Tracker and 3D vertical integration |
title_fullStr | The SuperB Silicon Vertex Tracker and 3D vertical integration |
title_full_unstemmed | The SuperB Silicon Vertex Tracker and 3D vertical integration |
title_short | The SuperB Silicon Vertex Tracker and 3D vertical integration |
title_sort | superb silicon vertex tracker and 3d vertical integration |
topic | Detectors and Experimental Techniques 3: Microelectronics and interconnection technology 3.2: 3D Interconnection |
url | http://cds.cern.ch/record/1426296 http://cds.cern.ch/record/1426296 |
work_keys_str_mv | AT revalerio thesuperbsiliconvertextrackerand3dverticalintegration AT revalerio superbsiliconvertextrackerand3dverticalintegration |