Planar Pixel Sensors for the ATLAS Upgrade: Beam Tests results

Results of beam tests with planar silicon pixel sensors aimed towards the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include spatial resolution, charge collection performance and charge sharing between neighbouring cells as a function of track inci...

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Detalles Bibliográficos
Autores principales: Weingarten, J., Altenheiner, S., Beimforde, M., Benoit, M., Bomben, M., Calderini, G., Gallrapp, C., George, M., Gibson, S., Grinstein, S., Janoska, Z., Jentzsch, J., Jinnouchi, O., Kishida, T., La Rosa, A., Libov, V., Macchiolo, A., Marchiori, G., Munstermann, D., Nagai, R., Piacquadio, G., Ristic, B., Rubinskiy, I., Rummler, A., Takubo, Y., Troska, G., Tsiskaridtze, S., Tsurin, I., Unno, Y., Weigel, P., Wittig, T.
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: JINST 2012
Materias:
Detectors and Experimental Techniques
9: Advanced infrastructures for detector R&D
9.3: Precision Pixel Detectors
Acceso en línea:https://dx.doi.org/10.1088/1748-0221/7/10/P10028
http://cds.cern.ch/record/1439241
Descripción
Sumario:Results of beam tests with planar silicon pixel sensors aimed towards the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include spatial resolution, charge collection performance and charge sharing between neighbouring cells as a function of track incidence angle for different bulk materials. Measurements of n-in-n pixel sensors are presented as a function of fluence for different irradiations. Furthermore p-type silicon sensors from several vendors with slightly differing layouts were tested. All tested sensors were connected by bump-bonding to the ATLAS Pixel read-out chip. We show that both n-type and p-type tested planar sensors are able to collect significant charge even after integrated fluences expected at HL-LHC.

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