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Semiconductor packaging: materials interaction and reliability

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Detalles Bibliográficos
Autores principales: Chen, Andrea, Lo, Randy Hsiao-Yu
Lenguaje:eng
Publicado: CRC Press 2012
Materias:
Acceso en línea:http://cds.cern.ch/record/1441650
Descripción
Sumario:In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how