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Semiconductor packaging: materials interaction and reliability
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
Autores principales: | , |
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Lenguaje: | eng |
Publicado: |
CRC Press
2012
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Materias: | |
Acceso en línea: | http://cds.cern.ch/record/1441650 |
_version_ | 1780924678498418688 |
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author | Chen, Andrea Lo, Randy Hsiao-Yu |
author_facet | Chen, Andrea Lo, Randy Hsiao-Yu |
author_sort | Chen, Andrea |
collection | CERN |
description | In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how |
id | cern-1441650 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2012 |
publisher | CRC Press |
record_format | invenio |
spelling | cern-14416502021-04-22T00:28:43Zhttp://cds.cern.ch/record/1441650engChen, AndreaLo, Randy Hsiao-YuSemiconductor packaging: materials interaction and reliabilityEngineeringIn semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how CRC Pressoai:cds.cern.ch:14416502012 |
spellingShingle | Engineering Chen, Andrea Lo, Randy Hsiao-Yu Semiconductor packaging: materials interaction and reliability |
title | Semiconductor packaging: materials interaction and reliability |
title_full | Semiconductor packaging: materials interaction and reliability |
title_fullStr | Semiconductor packaging: materials interaction and reliability |
title_full_unstemmed | Semiconductor packaging: materials interaction and reliability |
title_short | Semiconductor packaging: materials interaction and reliability |
title_sort | semiconductor packaging: materials interaction and reliability |
topic | Engineering |
url | http://cds.cern.ch/record/1441650 |
work_keys_str_mv | AT chenandrea semiconductorpackagingmaterialsinteractionandreliability AT lorandyhsiaoyu semiconductorpackagingmaterialsinteractionandreliability |