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Semiconductor packaging: materials interaction and reliability

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Detalles Bibliográficos
Autores principales: Chen, Andrea, Lo, Randy Hsiao-Yu
Lenguaje:eng
Publicado: CRC Press 2012
Materias:
Acceso en línea:http://cds.cern.ch/record/1441650
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author Chen, Andrea
Lo, Randy Hsiao-Yu
author_facet Chen, Andrea
Lo, Randy Hsiao-Yu
author_sort Chen, Andrea
collection CERN
description In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how
id cern-1441650
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2012
publisher CRC Press
record_format invenio
spelling cern-14416502021-04-22T00:28:43Zhttp://cds.cern.ch/record/1441650engChen, AndreaLo, Randy Hsiao-YuSemiconductor packaging: materials interaction and reliabilityEngineeringIn semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how CRC Pressoai:cds.cern.ch:14416502012
spellingShingle Engineering
Chen, Andrea
Lo, Randy Hsiao-Yu
Semiconductor packaging: materials interaction and reliability
title Semiconductor packaging: materials interaction and reliability
title_full Semiconductor packaging: materials interaction and reliability
title_fullStr Semiconductor packaging: materials interaction and reliability
title_full_unstemmed Semiconductor packaging: materials interaction and reliability
title_short Semiconductor packaging: materials interaction and reliability
title_sort semiconductor packaging: materials interaction and reliability
topic Engineering
url http://cds.cern.ch/record/1441650
work_keys_str_mv AT chenandrea semiconductorpackagingmaterialsinteractionandreliability
AT lorandyhsiaoyu semiconductorpackagingmaterialsinteractionandreliability