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Quality Assurance and Functionality Tests on Electrical Components during the ATLAS IBL Production
For the first ATLAS pixel upgrade scheduled in 2013 a new front-end chip generation (FE- I4) has been developed. The second version (FE-I4B) hosting two different solid-state sensor technologies (planar silicon and 3D silicon) has been produced to be built into a new pixel layer (the Insertable B-La...
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| Lenguaje: | eng |
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2012
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| Acceso en línea: | http://cds.cern.ch/record/1478168 |