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Advanced electronic packaging: with emphasis on multichip modules
Autores principales: | , |
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Lenguaje: | eng |
Publicado: |
Wiley-IEEE Press
2005
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Materias: | |
Acceso en línea: | http://cds.cern.ch/record/1480910 |
_version_ | 1780925915411251200 |
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author | Brown, William D Ulrich, Richard K |
author_facet | Brown, William D Ulrich, Richard K |
author_sort | Brown, William D |
collection | CERN |
id | cern-1480910 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2005 |
publisher | Wiley-IEEE Press |
record_format | invenio |
spelling | cern-14809102021-04-22T00:22:20Zhttp://cds.cern.ch/record/1480910engBrown, William DUlrich, Richard KAdvanced electronic packaging: with emphasis on multichip modulesEngineeringWiley-IEEE Pressoai:cds.cern.ch:14809102005 |
spellingShingle | Engineering Brown, William D Ulrich, Richard K Advanced electronic packaging: with emphasis on multichip modules |
title | Advanced electronic packaging: with emphasis on multichip modules |
title_full | Advanced electronic packaging: with emphasis on multichip modules |
title_fullStr | Advanced electronic packaging: with emphasis on multichip modules |
title_full_unstemmed | Advanced electronic packaging: with emphasis on multichip modules |
title_short | Advanced electronic packaging: with emphasis on multichip modules |
title_sort | advanced electronic packaging: with emphasis on multichip modules |
topic | Engineering |
url | http://cds.cern.ch/record/1480910 |
work_keys_str_mv | AT brownwilliamd advancedelectronicpackagingwithemphasisonmultichipmodules AT ulrichrichardk advancedelectronicpackagingwithemphasisonmultichipmodules |