Characterization of the FE-I4B pixel readout chip production run for the ATLAS Insertable B-layer upgrade

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A production run of FE-I4 pixel readout chips (denominated FE-I4B) was submittedSeptember 2011 and first wafers were received in December. These chips are being usedto build the Insertable B-Layer upgrade for ATLAS, to be installed during the 2013-14shutdown. Results will be presented for detailed p...

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Detalles Bibliográficos
Autores principales: Barbero, M, Backhaus, M, Garcia-Sciveres, M, Pohl, D
Lenguaje:eng
Publicado: 2012
Materias:
Detectors and Experimental Techniques
Acceso en línea:http://cds.cern.ch/record/1483034
Descripción
Sumario:A production run of FE-I4 pixel readout chips (denominated FE-I4B) was submittedSeptember 2011 and first wafers were received in December. These chips are being usedto build the Insertable B-Layer upgrade for ATLAS, to be installed during the 2013-14shutdown. Results will be presented for detailed probing characterization of thesewafers, as well as measurements of chips on boards before and after irradiation.Based on these test results, the FE-I4B has been accepted for IBL production and thepower conditioning configuration, using on-chip voltage regulators, has beenfinalized.

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