Quality Assurance and Functionality Tests on Electrical Components during the ATLAS IBL Production

To improve performance of the ATLAS inner tracker, a fourth Pixel layer, called the Insertable B-layer (IBL), will be installed in 2014 on a new beam pipe. A new read out chip generation, FE-I4, has been developed and two different sensor designs, a rather conventional planar and a 3D design, have been flip chipped to these front ends. New staves holding new stave and module flex circuits have been developed as well. Therefore, a production QA test bench has been established to test all production staves before integration with the new beam pipe. This setup combines former ATLAS Pixel services and a new readout system, namely the RCE (Reconfigurable Cluster Element) system developed at SLAC. With this setup all production staves will be tested to ensure the installation of only those staves which fulfill the IBL criteria. Quality assurance measurements under cleanroom conditions, including temperature and humidity control, are performed on the individual components during the various production steps of the IBL, namely connectivity as well as electrical tests and signal probing on individual parts and assembled subsystems. The pre-assembly QC procedures, the capabilities of the stave qualification setup, and recent results from testing a prototype stave are presented and discussed. The corresponding poster was presented on TWEPP (Topical Workshop on Electronics for Particle Physics) 2012 in Oxford, UK.