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The ATLAS Insertable B-Layer (IBL) Project
Preparing the hight luminosity LHC phase, the ATLAS experiment will upgrade his Pixel tracking system with the installation of a new pixel layer. The new sub detector, called the Insertable B-layer (IBL), will be installed during the LHC first shut down in 2013-2014, in between the innermost actual...
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Lenguaje: | eng |
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2012
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Acceso en línea: | http://cds.cern.ch/record/1500077 |
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author | Bilbao de Mendizabal, J |
author_facet | Bilbao de Mendizabal, J |
author_sort | Bilbao de Mendizabal, J |
collection | CERN |
description | Preparing the hight luminosity LHC phase, the ATLAS experiment will upgrade his Pixel tracking system with the installation of a new pixel layer. The new sub detector, called the Insertable B-layer (IBL), will be installed during the LHC first shut down in 2013-2014, in between the innermost actual pixel layer and the beampipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip FE-I4 and two different silicon sensor technologies, planar and 3D have been developed. Furthermore, the physics performance should be improved through the reduction of pixel size and a new mechanical support using lightweight staves. Two pre-series staves were made in order to qualify the assembly procedure, the loaded module electrical integrity and the read-out chain before going into production. |
id | cern-1500077 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2012 |
record_format | invenio |
spelling | cern-15000772019-09-30T06:29:59Zhttp://cds.cern.ch/record/1500077engBilbao de Mendizabal, JThe ATLAS Insertable B-Layer (IBL) ProjectDetectors and Experimental TechniquesPreparing the hight luminosity LHC phase, the ATLAS experiment will upgrade his Pixel tracking system with the installation of a new pixel layer. The new sub detector, called the Insertable B-layer (IBL), will be installed during the LHC first shut down in 2013-2014, in between the innermost actual pixel layer and the beampipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip FE-I4 and two different silicon sensor technologies, planar and 3D have been developed. Furthermore, the physics performance should be improved through the reduction of pixel size and a new mechanical support using lightweight staves. Two pre-series staves were made in order to qualify the assembly procedure, the loaded module electrical integrity and the read-out chain before going into production.ATL-INDET-PROC-2012-035oai:cds.cern.ch:15000772012-12-15 |
spellingShingle | Detectors and Experimental Techniques Bilbao de Mendizabal, J The ATLAS Insertable B-Layer (IBL) Project |
title | The ATLAS Insertable B-Layer (IBL) Project |
title_full | The ATLAS Insertable B-Layer (IBL) Project |
title_fullStr | The ATLAS Insertable B-Layer (IBL) Project |
title_full_unstemmed | The ATLAS Insertable B-Layer (IBL) Project |
title_short | The ATLAS Insertable B-Layer (IBL) Project |
title_sort | atlas insertable b-layer (ibl) project |
topic | Detectors and Experimental Techniques |
url | http://cds.cern.ch/record/1500077 |
work_keys_str_mv | AT bilbaodemendizabalj theatlasinsertableblayeriblproject AT bilbaodemendizabalj atlasinsertableblayeriblproject |