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The ATLAS Insertable B-Layer (IBL) Project

Preparing the hight luminosity LHC phase, the ATLAS experiment will upgrade his Pixel tracking system with the installation of a new pixel layer. The new sub detector, called the Insertable B-layer (IBL), will be installed during the LHC first shut down in 2013-2014, in between the innermost actual...

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Detalles Bibliográficos
Autor principal: Bilbao de Mendizabal, J
Lenguaje:eng
Publicado: 2012
Materias:
Acceso en línea:http://cds.cern.ch/record/1500077
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author Bilbao de Mendizabal, J
author_facet Bilbao de Mendizabal, J
author_sort Bilbao de Mendizabal, J
collection CERN
description Preparing the hight luminosity LHC phase, the ATLAS experiment will upgrade his Pixel tracking system with the installation of a new pixel layer. The new sub detector, called the Insertable B-layer (IBL), will be installed during the LHC first shut down in 2013-2014, in between the innermost actual pixel layer and the beampipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip FE-I4 and two different silicon sensor technologies, planar and 3D have been developed. Furthermore, the physics performance should be improved through the reduction of pixel size and a new mechanical support using lightweight staves. Two pre-series staves were made in order to qualify the assembly procedure, the loaded module electrical integrity and the read-out chain before going into production.
id cern-1500077
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2012
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spelling cern-15000772019-09-30T06:29:59Zhttp://cds.cern.ch/record/1500077engBilbao de Mendizabal, JThe ATLAS Insertable B-Layer (IBL) ProjectDetectors and Experimental TechniquesPreparing the hight luminosity LHC phase, the ATLAS experiment will upgrade his Pixel tracking system with the installation of a new pixel layer. The new sub detector, called the Insertable B-layer (IBL), will be installed during the LHC first shut down in 2013-2014, in between the innermost actual pixel layer and the beampipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip FE-I4 and two different silicon sensor technologies, planar and 3D have been developed. Furthermore, the physics performance should be improved through the reduction of pixel size and a new mechanical support using lightweight staves. Two pre-series staves were made in order to qualify the assembly procedure, the loaded module electrical integrity and the read-out chain before going into production.ATL-INDET-PROC-2012-035oai:cds.cern.ch:15000772012-12-15
spellingShingle Detectors and Experimental Techniques
Bilbao de Mendizabal, J
The ATLAS Insertable B-Layer (IBL) Project
title The ATLAS Insertable B-Layer (IBL) Project
title_full The ATLAS Insertable B-Layer (IBL) Project
title_fullStr The ATLAS Insertable B-Layer (IBL) Project
title_full_unstemmed The ATLAS Insertable B-Layer (IBL) Project
title_short The ATLAS Insertable B-Layer (IBL) Project
title_sort atlas insertable b-layer (ibl) project
topic Detectors and Experimental Techniques
url http://cds.cern.ch/record/1500077
work_keys_str_mv AT bilbaodemendizabalj theatlasinsertableblayeriblproject
AT bilbaodemendizabalj atlasinsertableblayeriblproject