Cargando…
Designing TSVs for 3D Integrated Circuits
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside groun...
| Autores principales: | , |
|---|---|
| Lenguaje: | eng |
| Publicado: |
Springer
2013
|
| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1007/978-1-4614-5508-0 http://cds.cern.ch/record/1500244 |