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Novel Silicon n-on-p Edgeless Planar Pixel Sensors for the ATLAS upgrade
In view of the LHC upgrade phases towards HL-LHC, the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness, that allow for enlarging the ar...
Autores principales: | , , , , , , , , , |
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Lenguaje: | eng |
Publicado: |
2012
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1016/j.nima.2013.04.022 http://cds.cern.ch/record/1501126 |
_version_ | 1780927034792345600 |
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author | Bomben, M. Bagolini, A. Boscardin, M. Bosisio, L. Calderini, G. Chauveau, J. Giacomini, G. La Rosa, A. Marchiori, G. Zorzi, N. |
author_facet | Bomben, M. Bagolini, A. Boscardin, M. Bosisio, L. Calderini, G. Chauveau, J. Giacomini, G. La Rosa, A. Marchiori, G. Zorzi, N. |
author_sort | Bomben, M. |
collection | CERN |
description | In view of the LHC upgrade phases towards HL-LHC, the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness, that allow for enlarging the area instrumented with pixel detectors. We report on the development of novel n-in-p edgeless planar pixel sensors fabricated at FBK (Trento, Italy), making use of the 'active edge' concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology and fabrication process, we present device simulations (pre- and post-irradiation) performed for different sensor configurations. First preliminary results obtained with the test-structures of the production are shown. |
id | cern-1501126 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2012 |
record_format | invenio |
spelling | cern-15011262023-03-14T19:41:31Zdoi:10.1016/j.nima.2013.04.022http://cds.cern.ch/record/1501126engBomben, M.Bagolini, A.Boscardin, M.Bosisio, L.Calderini, G.Chauveau, J.Giacomini, G.La Rosa, A.Marchiori, G.Zorzi, N.Novel Silicon n-on-p Edgeless Planar Pixel Sensors for the ATLAS upgradeDetectors and Experimental TechniquesIn view of the LHC upgrade phases towards HL-LHC, the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness, that allow for enlarging the area instrumented with pixel detectors. We report on the development of novel n-in-p edgeless planar pixel sensors fabricated at FBK (Trento, Italy), making use of the 'active edge' concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology and fabrication process, we present device simulations (pre- and post-irradiation) performed for different sensor configurations. First preliminary results obtained with the test-structures of the production are shown.In view of the LHC upgrade phases towards HL-LHC, the ATLAS experiment plans to upgrade the inner detector with an all-silicon system. The n-on-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness. The edgeless technology would allow for enlarging the area instrumented with pixel detectors. We report on the development of novel n-on-p edgeless planar pixel sensors fabricated at FBK (Trento, Italy), making use of the active edge concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology and fabrication process, we present device simulations (pre- and post-irradiation) performed for different sensor configurations. First preliminary results obtained with the test-structures of the production are shown.In view of the LHC upgrade phases towards HL-LHC, the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness, that allow for enlarging the area instrumented with pixel detectors. We report on the development of novel n-in-p edgeless planar pixel sensors fabricated at FBK (Trento, Italy), making use of the "active edge" concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology and fabrication process, we present device simulations (pre- and post-irradiation) performed for different sensor configurations. First preliminary results obtained with the test-structures of the production are shown.arXiv:1212.3580oai:cds.cern.ch:15011262012-12 |
spellingShingle | Detectors and Experimental Techniques Bomben, M. Bagolini, A. Boscardin, M. Bosisio, L. Calderini, G. Chauveau, J. Giacomini, G. La Rosa, A. Marchiori, G. Zorzi, N. Novel Silicon n-on-p Edgeless Planar Pixel Sensors for the ATLAS upgrade |
title | Novel Silicon n-on-p Edgeless Planar Pixel Sensors for the ATLAS upgrade |
title_full | Novel Silicon n-on-p Edgeless Planar Pixel Sensors for the ATLAS upgrade |
title_fullStr | Novel Silicon n-on-p Edgeless Planar Pixel Sensors for the ATLAS upgrade |
title_full_unstemmed | Novel Silicon n-on-p Edgeless Planar Pixel Sensors for the ATLAS upgrade |
title_short | Novel Silicon n-on-p Edgeless Planar Pixel Sensors for the ATLAS upgrade |
title_sort | novel silicon n-on-p edgeless planar pixel sensors for the atlas upgrade |
topic | Detectors and Experimental Techniques |
url | https://dx.doi.org/10.1016/j.nima.2013.04.022 http://cds.cern.ch/record/1501126 |
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