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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...
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| Lenguaje: | eng |
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Springer
2012
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| Acceso en línea: | https://dx.doi.org/10.1007/978-1-4614-1053-9 http://cds.cern.ch/record/1503725 |