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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of...
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| Lenguaje: | eng |
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Springer
2013
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| Acceso en línea: | https://dx.doi.org/10.1007/978-1-4419-9542-1 http://cds.cern.ch/record/1512942 |