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Electrical Resistance of the Solder Connections for the Consolidation of the LHC Main Interconnection Splices

For the consolidation of the LHC 13 kA main interconnection splices, shunts will be soldered onto each of the 10170 splices. The solder alloy selected for this purpose is Sn60Pb40. In this context the electrical resistance of shunt to busbar lap splices has been measured in the temperature range fro...

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Detalles Bibliográficos
Autores principales:	Lutum, R, Heck, S, Scheuerlein, C
Lenguaje:	eng
Publicado:	2013
Materias:	Accelerators and Storage Rings
Acceso en línea:	https://dx.doi.org/10.1109/TASC.2012.2233260 http://cds.cern.ch/record/1516069

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