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RD on 3D Sensors and Micro‐Fabricated Detector Systems
The aim of this proposed R&D Collaboration is the design, fabrication and industrialization of a new generation of low mass detector systems based on silicon micro‐fabrication techniques. The main objective is the verification and validation of such systems for LHC detector upgrades. In...
Autores principales: | , , |
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Publicado: |
2013
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Acceso en línea: | http://cds.cern.ch/record/1522477 |
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author | Da Via, C Petagna, P Dalla Betta, GF |
author_facet | Da Via, C Petagna, P Dalla Betta, GF |
author_sort | Da Via, C |
collection | CERN |
description | The aim of this proposed R&D Collaboration is the design, fabrication and industrialization of a new generation of low mass detector systems based on silicon micro‐fabrication techniques. The main objective is the verification and validation of such systems for LHC detector upgrades. In particular, the collaboration would like to focus on the following research topics: • Novel 3D sensors layouts, with enhanced signal properties, high speed and active edges. • Integrated micro‐channel cooling for effective low mass module thermal management. • System integration and fully sensitive large area coverage. |
id | cern-1522477 |
institution | Organización Europea para la Investigación Nuclear |
publishDate | 2013 |
record_format | invenio |
spelling | cern-15224772019-09-30T06:29:59Zhttp://cds.cern.ch/record/1522477Da Via, CPetagna, PDalla Betta, GFRD on 3D Sensors and Micro‐Fabricated Detector SystemsDetectors and Experimental TechniquesThe aim of this proposed R&D Collaboration is the design, fabrication and industrialization of a new generation of low mass detector systems based on silicon micro‐fabrication techniques. The main objective is the verification and validation of such systems for LHC detector upgrades. In particular, the collaboration would like to focus on the following research topics: • Novel 3D sensors layouts, with enhanced signal properties, high speed and active edges. • Integrated micro‐channel cooling for effective low mass module thermal management. • System integration and fully sensitive large area coverage.CERN-LHCC-2013-003LHCC-I-025oai:cds.cern.ch:15224772013-03-03 |
spellingShingle | Detectors and Experimental Techniques Da Via, C Petagna, P Dalla Betta, GF RD on 3D Sensors and Micro‐Fabricated Detector Systems |
title | RD on 3D Sensors and Micro‐Fabricated Detector Systems |
title_full | RD on 3D Sensors and Micro‐Fabricated Detector Systems |
title_fullStr | RD on 3D Sensors and Micro‐Fabricated Detector Systems |
title_full_unstemmed | RD on 3D Sensors and Micro‐Fabricated Detector Systems |
title_short | RD on 3D Sensors and Micro‐Fabricated Detector Systems |
title_sort | rd on 3d sensors and micro‐fabricated detector systems |
topic | Detectors and Experimental Techniques |
url | http://cds.cern.ch/record/1522477 |
work_keys_str_mv | AT daviac rdon3dsensorsandmicrofabricateddetectorsystems AT petagnap rdon3dsensorsandmicrofabricateddetectorsystems AT dallabettagf rdon3dsensorsandmicrofabricateddetectorsystems |