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Creep effects in diffusion bonding of oxygen-free copper
Diffusion is the transport of atoms or particles through the surrounding material. Various microstructural changes in metals are based on the diffusion phenomena. In solid metals the diffusion is closely related to crystallographic defects. In single-component metals the dominant mechanism of diffus...
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| Lenguaje: | eng |
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2013
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| Acceso en línea: | http://cds.cern.ch/record/1552918 |