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Signal integrity characterization techniques

"Signal Integrity Characterization Techniques" addresses the gap between traditional digital and microwave curricula all while focusing on a practical and intuitive understanding of signal integrity effects within the data transmission channel. High-speed interconnects such as connectors,...

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Detalles Bibliográficos
Autores principales: Resso, Mike, Bogatin, Eric
Lenguaje:eng
Publicado: International Engineering Consortium 2009
Materias:
Acceso en línea:http://cds.cern.ch/record/1560863
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author Resso, Mike
Bogatin, Eric
author_facet Resso, Mike
Bogatin, Eric
author_sort Resso, Mike
collection CERN
description "Signal Integrity Characterization Techniques" addresses the gap between traditional digital and microwave curricula all while focusing on a practical and intuitive understanding of signal integrity effects within the data transmission channel. High-speed interconnects such as connectors, PCBs, cables, IC packages, and backplanes are critical elements of differential channels that must be designed using today's most powerful analysis and characterization tools.Both measurements and simulation must be done on the device under test, and both activities must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements - from backplane for design challenges to error correction techniques to jitter measurement technologies. The authors' approach wisely addresses some of these new high-speed technologies, and it also provides valuable insight into its future direction and will teach the reader valuable lessons on the industry.
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institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2009
publisher International Engineering Consortium
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spelling cern-15608632021-04-21T22:35:09Zhttp://cds.cern.ch/record/1560863engResso, MikeBogatin, EricSignal integrity characterization techniquesEngineering"Signal Integrity Characterization Techniques" addresses the gap between traditional digital and microwave curricula all while focusing on a practical and intuitive understanding of signal integrity effects within the data transmission channel. High-speed interconnects such as connectors, PCBs, cables, IC packages, and backplanes are critical elements of differential channels that must be designed using today's most powerful analysis and characterization tools.Both measurements and simulation must be done on the device under test, and both activities must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements - from backplane for design challenges to error correction techniques to jitter measurement technologies. The authors' approach wisely addresses some of these new high-speed technologies, and it also provides valuable insight into its future direction and will teach the reader valuable lessons on the industry.International Engineering Consortiumoai:cds.cern.ch:15608632009
spellingShingle Engineering
Resso, Mike
Bogatin, Eric
Signal integrity characterization techniques
title Signal integrity characterization techniques
title_full Signal integrity characterization techniques
title_fullStr Signal integrity characterization techniques
title_full_unstemmed Signal integrity characterization techniques
title_short Signal integrity characterization techniques
title_sort signal integrity characterization techniques
topic Engineering
url http://cds.cern.ch/record/1560863
work_keys_str_mv AT ressomike signalintegritycharacterizationtechniques
AT bogatineric signalintegritycharacterizationtechniques