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ATLAS IBL Stave QA - In and Around SR1

During the Phase-I upgrade the ATLAS Inner tracker will have a whole new layer of pixels inserted between the existing B-layer and a new, smaller, beam pipe. Briefly, there are 14 assemblies of 32 single and double-chip hybrid silicon pixel chips arranged side-by-side on light-weight, thermally con...

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Detalles Bibliográficos
Autor principal: Carney, Rebecca
Lenguaje:eng
Publicado: 2013
Materias:
Acceso en línea:http://cds.cern.ch/record/1598080
Descripción
Sumario:During the Phase-I upgrade the ATLAS Inner tracker will have a whole new layer of pixels inserted between the existing B-layer and a new, smaller, beam pipe. Briefly, there are 14 assemblies of 32 single and double-chip hybrid silicon pixel chips arranged side-by-side on light-weight, thermally conductive carbon-fibre coated carbon foam supports called staves. When the staves arrive at CERN, fully assembled, they undergo a QA procedure, which checks the power characteristics of sensors and read-out chips, and assess the quality of individual pixels.