Cargando…
Component Processing
Autor principal: | Re, V. |
---|---|
Formato: | info:eu-repo/semantics/article |
Lenguaje: | eng |
Publicado: |
2013
|
Materias: | |
Acceso en línea: | http://cds.cern.ch/record/1610543 |
Ejemplares similares
-
3D interconnection processing accomplished
por: Re, V.
Publicado: (2014) -
CMOS MAPS in a Homogeneous 3D Process for Charged Particle Tracking
por: Manazza, A, et al.
Publicado: (2014) -
The path towards the application of new microelectronic technologies in the AIDA community
por: Re, V
Publicado: (2013) -
Status and perspectives of pixel sensors based on 3D vertical integration
por: Re, V
Publicado: (2014) -
Test interconnection and evaluation:
por: Re, V.
Publicado: (2014)