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Modeling and simulation for microelectronic packaging assembly: manufacturing, reliability and testing
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming ""test and try out"" method to obtain the best solution. Modeling and simulation can easily en...
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
Wiley
2011
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1613957 |